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Power module structure and solid state relay using same

  • US 20070134976A1
  • Filed: 11/30/2006
  • Published: 06/14/2007
  • Est. Priority Date: 12/14/2005
  • Status: Active Grant
First Claim
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1. A power module structure comprising:

  • a heat plate for contacting a heat sink;

    an insulating plate soldered to said heat plate;

    a terminal soldered to said insulating plate; and

    a semiconductor chip having contact point corresponding to said terminal so as to contact said terminal through said contact point;

    wherein said terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between said terminal and said insulating plate; and

    wherein said terminal has a force restricting part that serves to restrict said force and is locally formed as a soldering area through which said terminal is soldered to said insulating plate.

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