Single crystal shape memory alloy devices and methods
First Claim
1. A device comprising a mechanical component, the mechanical component being formed of a hyperelastic material having a crystalline phase change transition temperature.
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Abstract
Devices and methods of making devices having one or more components made of single crystal shape memory alloy capable of large recoverable distortions, defined herein as “hyperelastic” SMA. Recoverable Strains are as large as 9 percent, and in special circumstances as large as 22 percent. Hyperelastic SMAs exhibit no creep or gradual change during repeated cycling because there are no crystal boundaries. Hyperelastic properties are inherent in the single crystal as formed: no cold work or special heat treatment is necessary. Alloy components are Cu—Al—X where X may be Ni, Fe, Co, Mn. Single crystals are pulled from melt as in the Stepanov method and quenched by rapid cooling to prevent selective precipitation of individual elemental components. Conventional methods of finishing are used: milling, turning, electro-discharge machining, abrasion. Fields of application include aerospace, military, automotive, medical devices, microelectronics, and consumer products.
140 Citations
49 Claims
- 1. A device comprising a mechanical component, the mechanical component being formed of a hyperelastic material having a crystalline phase change transition temperature.
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16. A method of fabricating a single crystal shape memory alloy having hyperelastic properties, the method comprising the steps of:
- providing a molten melt of a copper aluminum based alloy, pulling a column of the alloy from the melt at a predetermined pulling rate, applying a predetermined hydrostatic pressure on the column and heating the column to a predetermined temperature, the predetermined pulling rate, hydrostatic pressure and temperature being sufficient to crystallize the alloy in the column into a single crystal, and quenching the single crystal.
- View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
Specification