THERMAL PROCESSING SYSTEM WITH ACROSS-FLOW LINER
First Claim
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1. An across-flow liner comprising:
- a cylinder having a sealed end and an open end, the open end adapted to receive a batch wafer carrier having a plurality of wafer support positions therethrough, said cylinder having a plurality of vertically displaced exhaust ports or slots; and
a first injector having a first series of axially aligned orifices, a first injector height and defining a first vertical axis, said first injector coupled to a first fluid supply and each of said first series of axially aligned orifices is in alignment with one of said plurality of wafer support positions.
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Abstract
An apparatus is provided for thermally processing substrates held in a carrier. The apparatus includes an across-flow liner to improve gas flow uniformity across the surface of each substrate. The across-flow liner of the present invention includes a longitudinal bulging section to accommodate a across-flow injection system. The liner is patterned and sized so that it is conformal to the wafer carrier, and as a result, reduces the gap between the liner and the wafer carrier to reduce or eliminate vortices and stagnation in the gap areas between the wafer carrier and the liner inner wall.
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Citations
37 Claims
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1. An across-flow liner comprising:
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a cylinder having a sealed end and an open end, the open end adapted to receive a batch wafer carrier having a plurality of wafer support positions therethrough, said cylinder having a plurality of vertically displaced exhaust ports or slots; and
a first injector having a first series of axially aligned orifices, a first injector height and defining a first vertical axis, said first injector coupled to a first fluid supply and each of said first series of axially aligned orifices is in alignment with one of said plurality of wafer support positions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An across-flow liner comprising:
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a cylinder having a sealed end and an open end, the open end adapted to receive a batch wafer carrier having a plurality of wafer support positions therethrough, said cylinder having a plurality of vertically displaced exhaust ports or slots wherein at least one of said plurality of vertically displaced exhaust ports or slots is in alignment with at least two of said plurality of wafer support positions; and
a first injector having a first series of axially aligned orifices, a first injector height and defining a first vertical axis, said first injector coupled to a first fluid supply and each of said first series of axially aligned orifices is in alignment with one of said plurality of wafer support positions. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A process of treating a batch of wafer substrates comprising:
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inserting the batch of wafer substrates on a wafer carrier into a liner within a treatment reactor;
exposing the batch of wafer substrates to a first gas emitted from a first series of orifices in a first vertical injector, each orifice of said first series of orifices being in alignment with a wafer substrate of the batch of wafer substrates;
exposing the wafer substrates to a second gas emitted from a second series of orifices in a second vertical injector, each of said second series of orifices in alignment with the wafer substrate so as to provide an across-flow of said first gas and said second gas across the wafer substrate; and
exhausting said first gas and said second gas from said liner Through a plurality of vertically displaced exhaust ports or slots. - View Dependent Claims (34, 35, 36, 37)
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Specification