HEATSINK WITH OFFSET FINS

• US 20070137849A1
• Filed: 12/15/2005
• Published: 06/21/2007
• Est. Priority Date: 12/15/2005
• Status: Abandoned Application

• Current Assignee: Toshiba International Corporation (Toshiba Corporation)
• Original Assignee: Toshiba International Corporation (Toshiba Corporation)
• Inventors: Vackar, Mark
• Application Number:
  US11/306,083
• Publication Number:
  US 20070137849A1
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heatsink assembly made of multiple heatsink sections to remove more heat than conventional heatsinks. The heatsink section'"'"'s length is based upon the point at which the flow becomes steady. The fins and air channels of adjacent heatsink sections are arranged so that air channels align with the fins of the corresponding adjacent heatsink section. This allows for the heatsink section to begin boundary layer growth over the fins again.

Claims

1. A heatsink assembly, comprising:

a) a series of heatsink sections;

b) said heatsink sections having a plurality of fins;

c) said heatsink sections being arranged such that an air channel of a leading heatsink section aligns with a fin of a trailing heatsink section.

2. The heatsink assembly of claim 1, wherein said fins are substantially parallel.

3. The heatsink assembly of claim 1, wherein the series of heatsink sections are formed as a single unit.

4. The heatsink assembly of claim 3, wherein the series of heatsink sections are integrally formed together as a single molded integral piece.

5. The heatsink assembly of claim 1, wherein the length of said fins is approximately delineated by a point where an airflow thereover becomes steady.

6. The heatsink assembly of claim 1, wherein the fins are substantially planar.

7. The heatsink assembly of claim 1, wherein said heatsink is positioned to dissipate heat from an electronic component.

8. The heatsink assembly of claim 1, wherein said heatsink includes one or more downstream fin positioned at a location so as to cause a boundary layer developed in an upstream air channel to be re-established over that downstream fin.

9. The heatsink assembly of claim 1, further including a means for establishing a forced convention flow in a direction of length of said fins.

11. The method of claim 9, further including locating one or more downstream fin at a location so as to cause a boundary layer developed in an upstream air channel between adjacent fins to be re-established over that downstream fin.

10. A method for constructing a heatsink assembly from a plurality of heatsink sections, each having a plurality of fins, comprising:

assembling the heatsink sections side-by-side such that an air channel of a first said heatsink section aligns with a second heatsink section fin.

12. A heatsink, comprising:

a) a plurality of sets of fins, each of said sets of fins including a plurality of generally parallel fins;

b) each of said sets of fins being arranged such that at least some air channels between adjacent fins of an upstream set of fins align with leading edges of fins of a downstream set of fins.

13. The heatsink of claim 12, wherein a leading edge of a fin in said downstream set of fins is located outside a boundary layer from airflow through the adjacent air channel between adjacent fins upstream thereto.

14. A method of dissipating heat with a heatsink, comprising:

a) providing a heat sink having a plurality of fins;

b) establishing a flow between adjacent fins so as to establish a first boundary layer;

c) re-creating the boundary layer so as to enhance heat distribution.

15. The method of claim 14, wherein said re-creation of the boundary layer is achieved by placement of a downstream fin outside of said first boundary layer.

16. The method of claim 14, further including re-creating the boundary layer after a steady flow is reached.

17. The method of claim 16, further including re-creating the boundary layer promptly after a steady flow is reached.

18. The method of claim 14, further including establishing a length of said fins so as to establish a steady flow between said fins.

19. The method of claim 14, further including locating one or more downstream fin at a location so as to cause a boundary layer developed in an upstream air channel between adjacent fins to be re-established over that downstream fin.

20. The method of claim 14, further including positioning said heatsink to dissipate heat from an electronic component.