Light-receiving module

• US 20070138493A1
• Filed: 01/24/2005
• Published: 06/21/2007
• Est. Priority Date: 01/26/2004
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Asada, Nobuo, Morimoto, Kazumi
• Application Number:
  US10/587,158
• Publication Number:
  US 20070138493A1
• Time in Patent Office: Days
• US Class Current: 257/95
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

A light receiving module M comprises a photodiode 1, an IC chip 2, a light permeable and electrically insulating sealing resin member 4 for sealing the photodiode 1 and the IC chip 2, a lens 43 provided at a surface of the sealing resin member 4 facing the photodiode 1, and a light impermeable and conductive coating5 for covering the sealing resin member 4 with the lens 43 being exposed. The coating 5 is connected to the ground and is made of a conductive resin, while being formed with a vertical wall 51 surrounding the lens 43.

Claims

1. A light receiving module comprising:

a light receiving element, an IC chip, a light permeable and electrically insulating sealing member for sealing the light receiving element and the IC chip, a lens provided at a surface of the sealing member facing the light receiving element, and a light impermeable and electroconductive coating for covering the sealing member with the lens exposed, the coating being connected to ground,

wherein the coating is provided with a vertical wall made up of an electroconductive member and surrounding the lens.

2. The light receiving module according to claim 1, wherein the lens is a convex lens,

wherein the vertical wall has a height greater than a height of the lens in a thickness direction of the lens.

3. The light receiving module according to claim 2, wherein the vertical wall includes an inner surface for reflecting light, the inner surface being inclined in a manner such that an inner diameter of the vertical wall is reduced as proceeding toward a bottom.

4. The light receiving module according to claim 1, wherein the sealing member and the electroconductive member are made of resin.