Power surface mount light emitting die package
First Claim
1. A semiconductor die package, comprising:
- a substrate having conductive traces on a top surface thereof, a light emitting diode (LED) mounted to the top surface of the substrate via a mounting pad, the mounting pad electrically connected to the conductive traces on the substrate top surface, a reflector plate mechanically coupled to the substrate and substantially surrounding the mounting pad and LED, the reflector plate defining a reflection surface, and a lens substantially covering the mounting pad and LED.
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Accused Products
Abstract
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).
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Citations
26 Claims
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1. A semiconductor die package, comprising:
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a substrate having conductive traces on a top surface thereof, a light emitting diode (LED) mounted to the top surface of the substrate via a mounting pad, the mounting pad electrically connected to the conductive traces on the substrate top surface, a reflector plate mechanically coupled to the substrate and substantially surrounding the mounting pad and LED, the reflector plate defining a reflection surface, and a lens substantially covering the mounting pad and LED. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A semiconductor die package, comprising:
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a substrate, a light emitting diode (LED) mounted on the substrate via a mounting pad so that the LED is electrically connected to a top surface of the substrate, a reflector plate coupled to the substrate and substantially surrounding the mounting pad and LED, the reflector plate having an opening there through, a lens placed in the opening to substantially cover the mounting pad, LED and opening, and an encapsulant covering the LED within at least part of the opening, wherein the lens adheres to the encapsulant so that the lens floats on the encapsulant within the opening. - View Dependent Claims (21, 22)
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23. A semiconductor die package, comprising:
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a substrate having a top surface;
an insulating film covering at least a portion of the top surface of the substrate;
a pair of conductive traces on the insulating film and insulated from the top surface of the substrate by the insulating film, one of the traces of the pair including a trace portion that serves as a mounting pad for mounting a light emitting die (LED) thereon;
a reflector plate coupled to the substrate and substantially surrounding the LED and mounting pad, the reflector plate including an opening and a ledge within the opening, and a lens coupled on the ledge of the reflector plate within the opening. - View Dependent Claims (24, 25, 26)
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Specification