Structure and method of making capped chip having discrete article assembled into vertical interconnect

• US 20070138644A1
• Filed: 12/15/2005
• Published: 06/21/2007
• Est. Priority Date: 12/15/2005
• Status: Abandoned Application

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Haba, Belgacem, Humpston, Giles, Burtzlaff, Robert, McWilliams, Bruce
• Application Number:
  US11/300,900
• Publication Number:
  US 20070138644A1
• Time in Patent Office: Days
• US Class Current: 257/774
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H03H 3/007 for the manufacture of electromechanical resonators or networks
• CPC Class Codes: H03H 9/1092 the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Abstract

A capped chip is provided which includes a chip having a front surface, a plurality of conductive features exposed at the front surface and a cap. The cap has an inner surface facing the front surface of the chip, an outer surface opposite the inner surface, and a through hole extending from the outer surface to the inner surface. A conductive interconnect extends at least partially through the through hole. The interconnect includes a conductive article which occupies a substantial portion of a volume of the interconnect and the interconnect further includes a flowable conductive medium which joins the conductive article to at least one of the plurality of conductive features of the chip or to the cap.

Claims

1. A capped chip, comprising:

a chip having a front surface and a plurality of conductive features exposed at said front surface;

a cap having an inner surface facing said front surface of said chip, an outer surface opposite said inner surface, and a through hole extending from said outer surface to said inner surface; and

a conductive interconnect extending at least partially through said through hole, said interconnect including a conductive article occupying a substantial portion of a volume of said interconnect, said interconnect further including a flowable conductive medium joining said conductive article to at least one of said plurality of conductive features or to said cap.

2. The capped chip as claimed in claim 1, wherein said flowable conductive medium is selected from the group consisting of a conductive adhesive and a fusible material.

3. The capped chip as claimed in claim 1, wherein said conductive article has a predetermined initial shape, said conductive article is adapted to substantially retain said predetermined initial shape when a temperature of said conductive article is elevated to an attach temperature at which said conductive article is joined by said flowable conductive medium.

4. The capped chip as claimed in claim 1, wherein said flowable conductive medium prevents said conductive article from moving relative to said flowable conductive medium at an operational temperature of said capped chip.

5. A capped chip as claimed in claim 1, wherein said conductive article is sized to fit entirely within one of said through holes.

6. A capped chip as claimed in claim 1, wherein said chip has a plurality of said conductive features, said conductive features including bond pads, said inner surface of said cap further being vertically spaced from said bond pads and said conductive articles being sized to fit through said through holes from said outer surface to said inner surface to contact said bond pads.

7. A capped chip as claimed in claim 6, wherein said conductive articles have rounded shape.

8. A capped chip as claimed in claim 7, wherein said conductive articles have substantially spherical shape.

9. A capped chip as claimed in claim 7, wherein said conductive articles have substantially cylindrical shape.

10. A capped chip as claimed in claim 1, wherein said conductive interconnect includes a plurality of said conductive articles.

11. A capped chip as claimed in claim 10, wherein said plurality of conductive articles of said at least one interconnect are arranged in a vertical stack.

12. A capped chip as claimed in claim 8, wherein said conductive articles have a polymeric core and a conductive coating overlying said polymeric core.

13. A capped chip as claimed in claim 10, wherein said conductive articles have a polymeric core and a conductive coating overlying said polymeric core.

14. A capped chip as claimed in claim 8, wherein said conductive articles include one or more materials selected from the group consisting of metals, ceramics, glasses and polymers and said conductive articles have a form selected from solid, hollow, foam or sponge.

15. A capped chip as claimed in claim 1, wherein exterior surfaces of said conductive articles are wettable by a fusible material and said flowable conductive medium includes said fusible material, said fusible material joined to said conductive articles within said through holes.

16. A capped chip as claimed in claim 15, wherein said fusible material includes at least one of a solder, tin and a eutectic composition.

17. A capped chip as claimed in claim 16, wherein said fusible material extends between said conductive feature and an area of said outer surface adjoining said through hole.

18. A capped chip as claimed in claim 17, wherein said fusible material at least partially overlies said outer surface of said cap member.

19. A capped chip as claimed in claim 15, wherein said cap consists essentially of at least one material selected from the group consisting of ceramics, metals, glasses, polymers and semiconductor materials.

20. A capped chip as claimed in claim 19, further comprising two or more layers of metal disposed on sidewalls of said through holes.

21. An assembly including a capped chip as claimed in claim 1 including a plurality of said conductive interconnects, further comprising a circuit panel having a plurality of terminals, wherein said conductive interconnects are joined to said terminals of said circuit panel.

22. A capped chip as claimed in claim 1, wherein said flowable conductive medium is said conductive adhesive and said conductive article is sealed to said cap member by said conductive adhesive.

23. An assembly including a capped chip as claimed in claim 1, wherein said conductive article is exposed at said outer surface of said cap member, said assembly further comprising an interconnection element, said interconnection element having at least one conductive contact compressed against said conductive article to conductively connect said interconnection element to said capped chip.

24. A capped chip as claimed in claim 5, wherein said through holes of said cap are tapered to become narrower in a first direction from said outer surface towards said inner surface and to become narrower in a second direction from said inner surface towards said outer surface.

25. A capped chip as claimed in claim 1, wherein a wall of said through hole is oriented at an angle of about 90 degrees to said outer surface.

26. A capped chip as claimed in claim 1, wherein said through hole is tapered, becoming uniformly smaller in a direction from said bottom surface towards said top surface.

27. A capped chip as claimed in claim 1, wherein said through hole is tapered, becoming uniformly smaller in a direction from said top surface towards said bottom surface.

28. A capped chip, comprising:

a chip having a front surface and a plurality of conductive features exposed at said front surface;

a cap having an inner surface facing said front surface of said chip, an outer surface opposite said inner surface, and a through hole extending from said outer surface to said inner surface; and

a conductive interconnect conductively contacting from one of said conductive features and extending through said through hole, said interconnect including a rod-like conductive article extending from below said inner surface of said cap to a level above said outer surface, said conductive article occupying a substantial portion of a volume of said interconnect, said conductive interconnect including a flowable conductive medium joining said conductive article to one of said plurality of conductive features or to said cap.

29. The capped chip as claimed in claim 28, wherein said conductive article includes a rod-like inner element having at least one of a conductive, nonconductive or semiconductive region and a conductive coating overlying an exterior of said inner element.

30. The capped chip as claimed in claim 28, wherein said conductive article includes at least one material selected from the group consisting of metals, ceramics, glasses and polymers.

31. The capped chip as claimed in claim 28, wherein said conductive article is hollow.

32. The capped chip as claimed in claim 28, wherein said conductive article includes at least one material in form of at least one selected from the group consisting of foam and sponge.

33. The capped chip as claimed in claim 28, wherein said conductive article is compliant, such that said conductive article is operable to yield under pressure applied to a top of said conductive article.

34. The capped chip as claimed in claim 28, wherein said through hole is tapered from a first opening size in said outer surface of said cap to a second opening size in said inner surface smaller than said first opening size and said conductive article has shape in form of a cylinder and a frustum extending outward from a portion of a length of said cylinder.

35. The capped chip as claimed in claim 28, wherein said conductive article has a wettable exterior surface and said flowable conductive medium wets said wettable exterior surface of said conductive article, said flowable conductive medium selected from the group consisting of a fusible conductive medium and a conductive adhesive.

41. The capped chip as claimed in claim 28, wherein said conductive article includes at least one material selected from the group consisting of metals, ceramics, glasses and polymers.

36. A method of forming a capped chip having a plurality of conductive interconnects, comprising:

aligning a cap member having an outer surface defining a major surface of said cap member and an inner surface opposite said outer surface to a chip having a contact-bearing surface and a plurality of contacts exposed at said contact-bearing surface, such that said inner surface of said cap member faces said contact-bearing surface of said chip;

providing a plurality of loose conductive articles in said through holes; and

flowing a conductive material into said through holes to bond said loose conductive articles to said exposed contacts to form said conductive interconnects.

37. A method as claimed in claim 36, wherein said step of flowing said conductive material includes elevating a temperature of said conductive material to a bonding temperature, said loose conductive articles being characterized by an initial shape prior to said step of flowing said conductive material, said loose conductive articles retaining said initial shape when said temperature is elevated to said bonding temperature.

38. A method of forming a capped chip comprising:

(a) providing a chip having a front surface and a plurality of conductive features at said front surface;

(b) assembling a lid having an outer surface, an inner surface opposite said outer surface and a plurality of through holes extending between said inner and outer surfaces, to said chip such that said bottom surface faces said front surface of said chip and said outer surface faces away from said chip, said through holes are aligned with said conductive features of said chip and said bottom surface is vertically spaced from said front surface of said chip;

(c) placing loose conductive articles into said through holes in contact with at least ones of i) said conductive features or ii) said lid; and

(d) forming conductive interconnects having conductive paths extending through at least portions of said conductive interconnects extending from said conductive features at least partially through said through holes,

said forming step including causing a flowable conductive material to flow in said through holes and conductively join said conductive articles to at least one of said plurality of conductive features or to said lid.

39. A method as claimed in claim 38, wherein said flowable conductive material is caused to flow into said through holes from said top surface of said lid to contact said conductive features of said chip.

40. A method as claimed in claim 39, wherein said through holes have walls wettable by said flowable conductive medium, said fiowable conductive material joined to said wettable walls.