Schottky Diode Device with Aluminum Pickup of Backside Cathode
First Claim
1. An integrated circuit package comprising:
- a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer;
a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device, the first surface of the discrete electronic device being attached to the metal pad using a conductive adhesive structure; and
an encapsulation material encapsulating the semiconductor chip and the discrete electronic device, wherein an electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package.
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Accused Products
Abstract
An integrated circuit package includes a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer and a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device where the first surface of the discrete electronic device is attached to the metal pad using a conductive adhesive structure. The semiconductor chip and the discrete electronic device are encapsulated in an encapsulation material. An electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package. In one embodiment, the metal pad is an aluminum pad and a metal line connects the metal pad to a bond pad of the semiconductor chip.
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Citations
12 Claims
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1. An integrated circuit package comprising:
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a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer;
a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device, the first surface of the discrete electronic device being attached to the metal pad using a conductive adhesive structure; and
an encapsulation material encapsulating the semiconductor chip and the discrete electronic device, wherein an electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A boost converter integrated circuit package comprising:
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a boost converter integrated circuit having a passivation layer forming the top surface of the boost converter integrated circuit and a metal pad formed on the passivation layer;
a discrete Schottky diode having an anode terminal formed on a topside and a cathode terminal formed on the backside of the Schottky diode, the backside of the discrete Schottky diode being attached to the metal pad using a conductive adhesive structure; and
an encapsulation material encapsulating the boost converter integrated circuit and the discrete Schottky diode, wherein a first electrical connection is formed between the metal pad and a first bond pad of the boost converter integrated circuit, thereby electrically connecting the cathode terminal to the first bond pad and a second electrical connection is formed using a bond wire between the anode terminal on the top side of the Schottky diode and a package post of the integrated circuit package.
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Specification