Electronic component having an encapsulating compound

• US 20070138658A1
• Filed: 12/13/2006
• Published: 06/21/2007
• Est. Priority Date: 12/20/2005
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Lerchenmueller, Klaus, Glatz, Alfred, Toikka, Gary
• Application Number:
  US11/638,936
• Publication Number:
  US 20070138658A1
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 27/327 Encapsulating or impregnating encapsulating coil and core H01F27/022
• CPC Class Codes: H01F 27/33 Arrangements for noise damping
• CPC Class Codes: H01F 38/12 Ignition, e.g. for IC engines
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic component, in particular an ignition coil, has an encapsulating compound which is formed by a mixture of an A component containing epoxy resin, a flexibilizator, additives, and fillers, and a B component containing at least one curing agent. The flexibilizator is formed from a material from the group of elastic thermoplastics and elastomers and is embedded in an epoxy matrix. To manufacture such an electronic component, the encapsulating compound is formed by mixing the A component with the B component, which contains at least one curing agent and optionally an accelerator, the A component being previously produced by mixing the epoxy resin with the flexibilizator, the additives, and the filler.

Claims

1. An electronic component, comprising:

an encapsulating compound formed by a mixture of an A component containing epoxy resin, a flexibilizator, additives, and fillers, and a B component containing at least one curing agent, wherein the flexibilizator is formed from a material from the group of elastic thermoplastics and elastomers and is embedded in an epoxy matrix.

2. The electronic component as recited in claim 1, wherein the epoxy resin is a cycloaliphatic epoxy resin or a bisphenol-A epoxy resin.

3. The electronic component as recited in claim 1,

wherein the elastomer is a thermoplastic elastomer.

4. The electronic component as recited in claim 1,

wherein the elastomer is a silicone.

5. The electronic component as recited in claim 1,

wherein the elastomer is a modified silicone, which is contained in the A component in a proportion of 2% by weight to 15% by weight.

6. The electronic component as recited in claim 5,

wherein the modified silicone is contained in the A component in a proportion of 2% by weight to 10% by weight.

7. The electronic component as recited claim 1,

wherein the proportion of filler particles that are smaller than approximately 2 μ

m to the particles that are greater than approximately 20 μ

m is at least approximately the same.

8. The electronic component as recited in one of claim 1,

wherein the filler is contained in the A component in a proportion of 50% by weight to 75% by weight.

9. The electronic component as recited in claim 1,

wherein the filler is made up of mineral constituents such as quartz sand, mica, or chalk.

10. The electronic component as recited in claim 1,

wherein the filler is made up of glass beads or glass fibers.

11. The electronic component as recited in claim 1,

wherein the curing agent is an anhydride curing agent corresponding to phthalic anhydride, and represents a heat-curing system.

12. The electronic component as recited in claim 1, wherein the A component is contained in the encapsulating compound in a proportion of 15% by weight to 40% by weight.

13. The electronic component as recited in claim 1, wherein an accelerator is also added to the B component.

14. The electronic component as recited in claim 1,

wherein the encapsulating viscosity of the encapsulating compound is less than 2000 mPas.

16. The electronic component as recited in claim 1, wherein the electronic component is an ignition coil.

15. A method for manufacturing an electronic component, comprising:

providing an encapsulating compound formed by a mixture of an A component containing epoxy resin, a flexibilizator, additives, and fillers, and a B component containing at least one curing agent, wherein the encapsulating compound is formed by mixing the A component with the B component, which contains at least one curing agent and optionally an accelerator, the A component being previously produced by mixing the epoxy resin with the flexibilizator, the additives, and the filler.