×

Electronic component having an encapsulating compound

  • US 20070138658A1
  • Filed: 12/13/2006
  • Published: 06/21/2007
  • Est. Priority Date: 12/20/2005
  • Status: Abandoned Application
First Claim
Patent Images

1. An electronic component, comprising:

  • an encapsulating compound formed by a mixture of an A component containing epoxy resin, a flexibilizator, additives, and fillers, and a B component containing at least one curing agent, wherein the flexibilizator is formed from a material from the group of elastic thermoplastics and elastomers and is embedded in an epoxy matrix.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×