Integrated current sensor package

• US 20070139066A1
• Filed: 12/19/2005
• Published: 06/21/2007
• Est. Priority Date: 12/19/2005
• Status: Active Grant

• Current Assignee: Silicon Laboratories Incorporated
• Original Assignee: Silicon Laboratories Incorporated
• Inventors: Dupuis, Timothy, Pavelka, John
• Granted Patent: US 7,679,162 B2
• Time in Patent Office: Days
• US Class Current: 324/117.R
• CPC Class Codes: G01R 15/181 using coils without a magnetic core, e.g. Rogowski coils
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: Y10S 257/904 with passive components,, e.g. polysilicon resistors
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Abstract

An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.

Claims

1. An integrated current sensor package, comprising:

an integrated circuit die including a coil in a metal layer of the integrated circuit; and

a wire integrated within the integrated circuit die package, the wire placed close enough to the coil such that the coil and the wire are inductively coupled with each other.

2. The integrate current sensor package of claim 1, wherein the coil is located in a top metal layer of the integrated circuit die.

3. The integrated current sensor package of claim 1, wherein the wherein the wire is located on top of the integrated circuit die.

4. The integrated current sensor package of claim 1, wherein the wire comprises a copper wire.

5. The integrated current sensor package of claim 1, wherein the wire overlaps only a first portion of the coil to enable an induced current within a second portion of the coil responsive to a current in the wire.

6. The integrated current sensor package of claim 1, further including a lead frame for supporting the integrated circuit die in an inverted position above the wire.

7. The integrated current sensor package of claim 6, wherein the lead frame is connected to the inverted integrated circuit die by solder balls.

8. An integrated circuit package including a current sensor, comprising:

a first area of the integrated circuit containing functional circuitry the functional circuitry contained in a substrate of the integrated circuit; and

a second area of the integrated circuit containing a coupled inductor for detecting a current.

9. The integrated circuit package of claim 8, wherein the coupled inductor further comprises:

a coil in a metal layer of the integrated circuit; and

a wire integrated within the integrated circuit, the wire placed close enough to the coil such that the coil and the wire are inductively coupled with each other.

10. The integrated circuit package of claim 9, wherein the coil is located in a top metal layer of the integrated circuit.

11. The integrated circuit package of claim 9, wherein the wherein the wire is located on top of the integrated circuit.

12. The integrated circuit package of claim 9, wherein the wire comprises a copper wire.

13. The integrated circuit package of claim 9, wherein the wire overlaps only a first portion of the coil to enable an induced current within a second portion of the coil responsive to a current in the wire.

14. The integrated circuit package of claim 9, further including a lead frame for supporting the integrated circuit in an inverted position above the wire.

15. The integrated circuit package of claim 14, wherein the lead frame is connected to the inverted integrated circuit by solder balls.

16. An integrated circuit package including a current sensor, comprising:

a first area of the integrated circuit containing functional circuitry the functional circuitry contained in a substrate of the integrated circuit; and

a second area of the integrated circuit containing a coupled inductor for detecting a current, wherein the coupled inductor further comprises;

a coil in a metal layer of the integrated circuit; and

a copper wire located on top of the integrated circuit, the wire placed close enough to the coil such that the coil and the wire are inductively coupled with each other, wherein the wire overlaps only a first portion of the coil to enable an induced current within a second portion of the coil responsive to a current in the wire.

17. The integrated circuit package of claim 16, wherein the coil is located in top metal layer of the integrated circuit.

18. The integrated circuit package of claim 16, further including a lead frame for supporting the integrated circuit in an inverted position above the wire.

19. The integrated circuit package of claim 18, wherein the lead frame is connected to the inverted integrated circuit by solder balls.