Lithographic apparatus and device manufacturing method using interferometric and maskless exposure units
First Claim
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1. A lithographic system for exposing a pattern on a substrate, comprising:
- a first exposure unit that projects two beams of radiation onto at least a portion of the substrate, such that the two beams of radiation interfere to expose a plurality of lines; and
a second exposure unit that modulates a beam of radiation using an array of individually controllable elements and projects the modulated beam onto at least a portion of the substrate;
wherein the first and second exposure units are configured such that a pitch of the lines exposed by the first exposure unit, in a direction perpendicular to a length of the lines, is an integer multiple of a width, in a direction of the exposure on the substrate by the second exposure unit, corresponding to a single individually controllable element.
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Abstract
A lithographic system combining an interference exposure unit and a lithography unit. The lithography unit can comprise an array of individually controllable elements. The lithography system can be arranged such that a pitch of the lines exposed by the interference exposure unit is an integer multiple of a size of an exposure area of the lithography unit corresponding to a single individually controllable element.
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Citations
23 Claims
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1. A lithographic system for exposing a pattern on a substrate, comprising:
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a first exposure unit that projects two beams of radiation onto at least a portion of the substrate, such that the two beams of radiation interfere to expose a plurality of lines; and
a second exposure unit that modulates a beam of radiation using an array of individually controllable elements and projects the modulated beam onto at least a portion of the substrate;
wherein the first and second exposure units are configured such that a pitch of the lines exposed by the first exposure unit, in a direction perpendicular to a length of the lines, is an integer multiple of a width, in a direction of the exposure on the substrate by the second exposure unit, corresponding to a single individually controllable element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A device manufacturing method, comprising:
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performing a first type of exposure on a substrate by projecting two beams of radiation onto at least a portion of the substrate, such that the two beams of radiation interfere to expose a plurality of lines; and
performing a second type of exposure on the substrate by modulating a beam of radiation using an array of individually controllable elements and projecting the modulated beam of radiation onto at least a portion of the substrate, wherein a pitch of the lines exposed by the first type of exposure, in a direction perpendicular to a length of the lines, is an integer multiple of a width, in the direction of an exposure on the substrate of the second type, corresponding to a single individually controllable element. - View Dependent Claims (14, 15)
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16. A lithographic system for exposing a pattern on a substrate, comprising:
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a radiation sensitive layer processing unit that performs at least one of;
(a) applying a layer of radiation sensitive material to a substrate before an exposure, (b) heating the unexposed substrate, applying an anti-reflective coating to the substrate, (c) applying a water impermeable coating to the substrate, (d) applying a coating to the substrate to make the surface hydrophobic or hydrophilic, (e) heating the substrate after exposure, (f) controlled cooling of the substrate after heating, (g) removal of one or more of an anti-reflective coating, (h) a water impermeable coating and a hydrophobic or (i) hydrophilic coating and removal of one of exposed and unexposed resist from the substrate;
a lithography unit that modulates a beam of radiation and projects the modulated radiation beam onto a substrate; and
an interference exposure unit that projects two beams of radiation onto at least a portion of the substrate, such that the two beams of radiation interfere to expose a plurality of lines on the substrate;
wherein the interference exposure unit is arranged such that a substrate is transferred from the radiation sensitive layer processing unit to the lithography unit through the interference exposure unit. - View Dependent Claims (17, 18, 19)
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20. An interference exposure unit, comprising:
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a device that projects two beams of radiation onto at least a portion of a substrate, such that the two beams of radiation interfere to expose a plurality of lines on the substrate;
wherein the interference exposure unit is configured to transfer the substrate between a radiation sensitive layer processing unit and a lithography unit, wherein the radiation sensitive layer processing unit performs at least one of;
(a) applying a layer of radiation sensitive material to a substrate before an exposure, (b) heating the unexposed substrate, applying an anti-reflective coating to the substrate, (c) heating the substrate after exposure, (d) controlled cooling of the substrate after heating and (e) removal of one of exposed and unexposed resist from the substrate, andwherein the lithography unit modulates a beam of radiation and project the modulated beam of radiation onto a substrate.
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21. A device manufacturing method, comprising:
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processing a substrate in a radiation sensitive layer processing unit that performs at least one of;
(a) applying a layer of radiation sensitive material to a substrate before an exposure, (b) heating the unexposed substrate, (c) applying an anti-reflective coating to the substrate, (d) heating the substrate after exposure, (e) controlled cooling of the substrate after heating and (f) removal of one of exposed and unexposed resist from the substrate; and
projecting a modulated beam of radiation onto the substrate in a lithography unit; and
transferring the substrate through an interference exposure unit, in which beams of radiation are projected onto at least a portion of the substrate, such that the two beams of radiation interfere to expose a plurality of lines on the substrate, between at least one processing step performed in the radiation sensitive layer processing unit and at least one radiation beam projection step performed in the lithography unit. - View Dependent Claims (22, 23)
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Specification