FEEDBACK CONTROLLED MAGNETO-HYDRODYNAMIC HEAT SINK

• US 20070139889A1
• Filed: 12/21/2005
• Published: 06/21/2007
• Est. Priority Date: 12/21/2005
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Ouyang, Chien
• Granted Patent: US 7,245,495 B2
• Time in Patent Office: Days
• US Class Current: 361/701
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is used to take temperature measurements of the hot spot. A value of the induced electrical current is adjusted dependent on one or more temperature measurements taken by the temperature sensor.

Claims

1. A computer system, comprising:

an integrated circuit;

a lid disposed over the integrated circuit;

a temperature sensor disposed on the lid and arranged to measure a temperature of a hot spot of the integrated circuit; and

a heat sink operatively connected to the lid, the heat sink comprising;

a pipe operatively connected to the temperature sensor, and

a pump assembly operatively connected to the pipe and arranged to generate a magnetic field, wherein fluid flow within the pipe is dependent on the magnetic field and the temperature sensor.

2. The computer system of claim 1, the pump assembly comprising:

at least two magnets, wherein the magnetic field is induced between the at least two magnets.

3. The computer system of claim 1, the pump assembly comprising:

a first electrical conductor; and

a second electrical conductor,

wherein fluid flow within the pipe is dependent on an electrical current induced between the first electrical conductor and the second electrical conductor.

4. The computer system of claim 3, wherein the induced electrical current is dependent on the temperature sensor.

5. The computer system of claim 1, the pipe comprising:

a first pipe; and

a second pipe inside and concentric with the first pipe.

6. The computer system of claim 5, wherein fluid flow in the first pipe and outside the second pipe is one of away from and toward the hot spot, and wherein fluid flow in the second pipe is the other of the one of away from and toward the hot spot.

7. The computer system of claim 1, further comprising:

a ferromagnetic metal piece arranged to at least partially shield the magnetic field.

8. The computer system of claim 1, wherein the pump assembly is disposed outside a body of the heat sink.

9. The computer system of claim 1, the pump assembly comprising:

a plastic ring, wherein at least one electrical conductor is disposed along a surface of the plastic ring, and wherein at least one magnet is disposed along a surface of the plastic ring.

10. The computer system of claim 1, wherein the pump assembly is cylindrical in shape.

11. The computer system of claim 1, wherein the fluid is at least one of thermally and electrically conductive.

12. The computer system of claim 1, wherein the lid comprises a recess arranged to at least partially house the integrated circuit.

13. A method of cooling an hot spot of an integrated circuit, comprising:

generating a magnetic field;

inducing an electrical current through the magnetic field;

propagating electrically and thermally conductive fluid toward the hot spot and away from the hot spot dependent on the magnetic field and the electrical current;

measuring a temperature of the hot spot; and

adjusting the electrical current dependent on the measuring.

14. The method of claim 13, further comprising:

at least partially shielding the magnetic field.

15. The method of claim 13, wherein a rate of flow of the fluid is dependent on the electrical current.

16. A heat sink, comprising:

a body having a plurality of fins configured to dissipate heat;

a pipe extending through the body and arranged to propagate electrically and thermally conductive fluid, wherein the pipe is further adapted to cool a hot spot of an integrated circuit; and

a pump assembly operatively connected to the pipe and arranged to generate a magnetic field and an electrical current, wherein fluid flow within the pipe is dependent on the magnetic field and a temperature of the hot spot.

17. The heat sink of claim 16, wherein a value of the electrical current is dependent on the temperature.

18. The heat sink of claim 16, the pipe comprising:

an interior pipe concentric with the pipe, wherein fluid flow in the pipe and outside of the interior pipe is opposite to fluid flow in the interior pipe.

19. The heat sink of claim 16, further comprising:

a ferromagnetic metal piece arranged to at least partially shield the magnetic field.

20. The heat sink of claim 16, wherein the pump assembly is disposed outside the body.