Low-profile assemblies for providing board level EMI shielding for electrical components on opposite sides of printed circuit boards

• US 20070139904A1
• Filed: 08/31/2006
• Published: 06/21/2007
• Est. Priority Date: 12/16/2005
• Status: Abandoned Application

• Current Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Original Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Inventors: Zuehlsdorf, Allan, English, Gerald
• Application Number:
  US11/514,071
• Publication Number:
  US 20070139904A1
• Time in Patent Office: Days
• US Class Current: 361/818
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids

Abstract

An EMI shielding assembly generally includes a frame attachable to the board'"'"'s first side, and first and second covers configured to be respectively positioned on generally opposite sides of the board. The first cover is configured to cover at least one opening along an upper portion of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board'"'"'s generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board'"'"'s first side that are within a first interior defined by the frame'"'"'s walls, first cover, and at least a portion of the board'"'"'s first side, and one or more electrical components on the board'"'"'s second side that are within a second interior defined by the second cover and at least a portion of the board'"'"'s second side.

Claims

1. An assembly for providing EMI shielding for electrical components on generally opposite first and second sides of a board, the assembly comprising:

a frame attachable to the board'"'"'s first side, the frame including walls and at least one opening along an upper portion of the frame, the frame'"'"'s walls configured to be disposed generally about one or more electrical components on the board'"'"'s first side;

a first cover configured to cover the at least one opening of the frame;

a second cover attachable to the first cover with the first and second covers respectively positioned along the board'"'"'s generally opposite first and second sides;

whereby the assembly is operable for shielding one or more electrical components on the board'"'"'s first side that are within a first interior defined by the frame'"'"'s walls, first cover, and at least a portion of the board'"'"'s first side, and one or more electrical components on the board'"'"'s second side that are within a second interior defined by the second cover and at least a portion of the board'"'"'s second side.

2. An electronic device including the assembly of claim 1, and a printed circuit board having electrical components on generally opposite first and second sides, and wherein the frame is attached to the board'"'"'s first side, the first cover is disposed generally over the frame such that at least one electrical component on the board'"'"'s first side is disposed within the first interior defined by the frame'"'"'s walls, first cover, and at least a portion of the board'"'"'s first side, and the second cover is attached to the first cover such that at least one electrical component on the board'"'"'s second side is disposed within the second interior defined by the second cover and at least a portion of the board'"'"'s second side.

3. The assembly of claim 1, wherein the assembly is configured such that the attachment of the second cover to the first cover also retains the positioning of the first cover relative to the frame.

4. The assembly of claim 1, wherein the second cover is removably attachable to the first cover.

5. The assembly of claim 1, wherein the assembly includes only one frame.

6. The assembly of claim 1, wherein the first cover includes a lid portion configured to cover the at least one opening of the frame, and tabs downwardly depending relative to the lid portion, the tabs having sufficient length for extending across a thickness defined between the board'"'"'s first and second sides to thereby allow positioning of the end portions of the tabs on a side of the board opposite that of the lid portion.

7. The assembly of claim 6, wherein the end portions of the tabs include one or more protrusions configured for interlocking engagement with corresponding openings of the second cover.

8. The assembly of claim 6, wherein the end portions of the tabs are configured for positioning through corresponding holes in the board for engagement with the second cover.

9. The assembly of claim 6, wherein the end portions of the tabs are configured for positioning through corresponding notches defined along a periphery of the board for engagement with the second cover.

10. The assembly of claim 9, wherein the end portions of the tabs comprise inwardly extending half-dimples defining detents configured for interlocking engagement with corresponding openings of the second cover.

11. The assembly of claim 10, wherein the end portions of the tabs include camming surfaces for urging the tabs outwardly away from the frame thereby facilitating the positioning of the tabs through the corresponding notches generally around the board for interlockingly engaging the detents with the corresponding openings of the second cover.

12. The assembly of claim 1, wherein at least one of said first and second covers includes one or more protrusions for interlocking engagement with corresponding openings of the other one of said first and second covers to thereby attach the second cover to the first cover, and wherein the interlocking engagement of the one or more protrusions within the corresponding openings also retains the positioning of the first cover relative to the frame.

13. The assembly of claim 1, further comprising a plurality of interior EMI shielding compartments within at least one of said first and second interiors.

14. The assembly of claim 13, further comprising one or more electrically-conductive elastomeric members disposed along at least a portion of at least one of said first and second covers for defining at least a portion of at least one of said interior EMI shielding compartments.

15. The assembly of claim 1, further comprising at least one thermal interface material disposed on an interior portion of at least one of said first and second covers for forming a thermally-conducting heat path from one or more electrical components of the board to the assembly.

16. The assembly of claim 1, further comprising at least one resilient member disposed on an inner side of the first cover'"'"'s lid portion, and wherein the frame includes at least one cutout portion configured to provide sufficient clearance for the at least one resilient member to thereby allow the first cover to be disposed generally over the frame without interfering contact between the at least one resilient member and the frame.

17. The assembly of claim 1, wherein at least one of said first and second covers comprises sheet metal.

18. A low-profile assembly for providing board-level EMI shielding for electrical components on generally opposite first and second sides of a board, the assembly comprising:

a frame attachable to the board'"'"'s first side, the frame including walls and at least one opening along an upper portion of the frame, the frame'"'"'s walls configured to be disposed generally about one or more electrical components on the board'"'"'s first side;

a first cover having a lid portion to cover the at least one opening of the frame, and wall portions downwardly depending relative to the lid portion with sufficient length for extending across a thickness defined between the board'"'"'s first and second sides to thereby allow positioning of the end portions of the first cover'"'"'s wall portions on a side of the board opposite that of the lid portion,

a second cover;

at least one of said first and second covers including one or more protrusions for interlocking engagement with corresponding openings of the other one of said first and second covers to thereby attach the second cover to the first cover, the interlocking engagement of the one or more protrusions with the corresponding openings also retaining the relative positioning of the first cover generally over the frame with the lid portion covering the at least one opening of the frame;

whereby the assembly is operable for shielding one or more electrical components on the board'"'"'s first side that are within a first interior defined by the frame'"'"'s walls, first cover, and at least a portion of the board'"'"'s first side, and one or more electrical components on the board'"'"'s second side that are within a second interior defined by the second cover and at least a portion of the board'"'"'s second side.

19. The assembly of claim 18, wherein the end portions of the first cover'"'"'s wall portions comprise detents configured for interlocking engagement with corresponding openings of the second cover.

20. The assembly of claim 18, wherein the end portions of the first cover'"'"'s wall portions are configured for positioning through corresponding openings of the board for engagement with the second cover.

21. The assembly of claim 18, further comprising a plurality of interior EMI shielding compartments within at least one of said first and second interiors.

22. The assembly of claim 21, further comprising one or more electrically-conductive elastomeric members disposed along at least a portion of at least one of said first and second covers for defining at least a portion of at least one of said interior EMI shielding compartments.

23. The assembly of claim 18, further comprising at least one resilient member disposed on an inner side of the first cover'"'"'s lid portion, and wherein the frame includes at least one cutout portion configured to provide sufficient clearance for the at least one resilient member to thereby allow the first cover to be disposed generally over the frame without interfering contact between the at least one resilient member and the frame.

24. A method of providing EMI shielding for electrical components on generally opposite first and second sides of a board, the method comprising:

positioning a first cover relative to a frame such that one or more electrical components on the board'"'"'s first side are within a first interior defined by the frame, first cover, and at least a portion of the board'"'"'s first side; and

attaching a second cover to the first cover such that the first and second covers are respectively positioned along the board'"'"'s generally opposite first and second sides, and such that one or more electrical components on the board'"'"'s second side are within a second interior defined by the second cover and at least a portion of the board'"'"'s second side.

25. The method of claim 24, further comprising attaching the frame to the board'"'"'s first side.

26. The method of claim 24, wherein attaching the second cover to the first cover includes interlockingly engaging one or more protrusions of at least one of said first and second covers with corresponding openings of the other one of said first and second covers.

27. The method of claim 26, wherein the interlocking engagement of the one or more protrusions with the corresponding openings also retains the relative positioning of the first cover to the frame.

28. The method of claim 24, wherein the first cover includes a lid portion configured to cover the at least one opening of the frame, and tabs downwardly depending relative to the lid portion, and wherein the method includes covering the at least one opening of the frame with the lid portion, and positioning the first cover relative to the board such that end portions of the tabs are on a side of the board opposite that of the lid portion.

29. The method of claim 28, wherein attaching the second cover to the first cover includes interlockingly engaging one or more protrusions of the tabs with corresponding openings of the second cover.

30. The method of claim 28, wherein positioning the first cover relative to the board includes positioning the end portions of the tabs through corresponding openings in the board.

31. The method of claim 28, further comprising detaching the second cover from the first cover to access one or more electrical components on the board'"'"'s second side.

32. The method of claim 31, further comprising reusing the removed second cover, or using a replacement second cover.

33. The method of claim 31, further comprising, after detaching the second cover from the first cover, moving the first cover relative to the frame to uncover the at least one opening of the frame to thereby allow access to one or more electrical components on the board'"'"'s first side through the at least one opening of the frame.

34. The method of claim 33, further comprising reusing the removed first cover, or using a replacement first cover.