Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

• US 20070141760A1
• Filed: 12/21/2005
• Published: 06/21/2007
• Est. Priority Date: 12/21/2005
• Status: Active Grant

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Mehrabi, Ali, Mehrabi, Reza, Ferguson, Scott
• Granted Patent: US 8,067,253 B2
• Time in Patent Office: Days
• US Class Current: 438/127
• CPC Class Codes: B29C 2035/0822 using IR radiation
• CPC Class Codes: B29C 2035/0827 using UV radiation
• CPC Class Codes: B29C 2035/0855 using microwave
• CPC Class Codes: B29C 2043/3615 Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
• CPC Class Codes: B29C 35/0888 using transparant moulds
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

Claims

1. A method of making an electrical device comprising:

placing a chip on a substrate;

heating the substrate; and

embedding the chip into the substrate while the substrate is at an elevated temperature.

2. A method as set forth in claim 1, wherein the placing a chip on a substrate includes placing a chip that is part of an RFID interposer that includes interposer leads mounted to the chip.

3. A method as set forth in claim 1, wherein the placing a chip on a substrate includes placing the chip on a substrate that is a thermoplastic material.

4. A method as set forth in claim 1, wherein the applying heat to the substrate includes applying electromagnetic radiation to at least one of the chip and the substrate.

5. A method as set forth in claim 4, wherein the applying electromagnetic radiation includes applying thermal radiation.

6. A method as set forth in claim 4, wherein the applying electromagnetic radiation includes applying near infrared radiation.

7. A method as set forth in claim 1, wherein the embedding includes pressing the chip into the substrate with rollers.

8. A method as set forth in claim 1, wherein the embedding includes pressing the chip into the substrate with a press.

9. A method as set forth in claim 1, further comprising coupling the chip to an electrical component.

10. A method as set forth in claim 9, wherein the coupling the chip to an electrical component includes coupling the chip to an antenna structure.

11. A method as set forth in claim 9, wherein the coupling includes laminating a web that includes the electrical component to the substrate.

12. A method as set forth in claim 9, wherein the coupling includes printing a conductive material onto the substrate.

13. A method as set forth in claim 9, wherein the coupling includes coupling the chip to an antenna structure preformed on the substrate.

14. The device formed by the method of claim 1.

15. A method of making an electrical device comprising:

heating a chip;

embedding the chip in a substrate; and

coupling the chip to an electrical component.

16. A method as set forth in claim 15, wherein the embedding the chip in the substrate includes heating, with the chip, a region of the substrate in which the chip is to be embedded.

17. A method as set forth in claim 16, wherein the heating includes conductive heating.

18. A method as set forth in claim 15, further comprising laminating a planarizer layer to at least one of the chip or substrate, the planarizer layer including the electrical component.

19. A method as set forth in claim 18, wherein the laminating includes pressing together of the planarizer layer and at least one of the chip or the substrate;

and wherein the pressing effects the embedding and the coupling.

20. A method as set forth in claim 15, wherein the chip is part of an RFID interposer that includes interposer leads attached to an RFID chip.

21. A method as set forth in claim 15, wherein the substrate is a thermoplastic material.

22. A method as set forth in claim 15, wherein the heating the chip includes applying electromagnetic radiation to the chip.

23. A method as set forth in claim 22, wherein the applying electromagnetic radiation includes applying thermal radiation.

24. A method as set forth in claim 23, wherein the applying electromagnetic radiation includes applying near infrared radiation

25. A method as set forth in claim 15, wherein the embedding includes pressing the chip into the substrate with rollers.

26. A method as set forth in claim 15, wherein the embedding includes pressing the chip into the substrate with a press.

27. A method as set forth in claim 15, wherein the coupling the chip to an electrical component includes coupling the chip to an antenna structure.

28. A method as set forth in claim 15, wherein the coupling includes laminating a web that includes the electrical component to the substrate.

29. A method as set forth in claim 15, further comprising providing a planarizer layer between the chip and the web, wherein the planarizer layer is an adhesive.

30. A method as set forth in claim 15, wherein the coupling includes printing a conductive material onto the substrate.

31. A method as set forth in claim 15, wherein the coupling includes coupling the chip to an antenna structure preformed on the substrate.

32. The device formed by the method of claim 15.

33. A method of making an RFID transponder comprising:

placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;

heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;

embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and

coupling the chip to an antenna structure, wherein the coupling includes;

depositing the antenna structure with conductive ink onto the thermoplastic substrate; and

connecting the antenna structure to the interposer leads of the RFID interposer.

34. The device formed by the method of claim 33.

35. A method of making an RFID transponder comprising:

providing a web material, the web material including a continuous conductive element and a compressible substrate layer;

forming a recess in the web material by compressing the compressible substrate layer, wherein forming the recess divides the conductive element thereby forming at least two antenna portions;

placing a chip in the recess; and

coupling the chip to the antenna portions,

wherein the forming the recess includes pressing together of the chip and web material, and

wherein the pressing effects the placing and the coupling.

36. A method as set forth in claim 35, wherein the compressible substrate layer is a foam material.

37. A method as set forth in claim 35, wherein the compressible substrate layer is crushable.

38. A method of making an RFID transponder comprising:

providing a web material, the web material including a compressible substrate layer and an antenna structure having a first antenna portion and a second antenna portion;

forming a recess in the web material between the first and second antenna portions by compressing the compressible substrate layer;

placing a chip in the recess; and

coupling the chip antenna portions of the antenna structure;

wherein the forming the recess includes pressing together of the chip and web material, and

wherein the pressing effects the placing and the coupling.

39. A method as set forth in claim 39, wherein the compressible substrate layer is a foam material.

40. A method as set forth in claim 39, wherein the compressible substrate layer is crushable.

41. An electrical device comprising;

a chip; and

a substrate;

wherein the chip is embedded in the substrate; and

wherein the chip is at least partially encased by the substrate.

42. A device as set forth in claim 41, further comprising an electrical component coupled to bond pads on the chip.

43. A device as set forth in claim 42, wherein the electrical component is an antenna structure provided on a planarizer layer, and wherein the bond pads extend through the planarizer layer and are coupled to the antenna structure.

44. A device as set forth in claim 42, wherein the bond pads are stud bumps.

45. A device as set forth in claim 41, wherein the substrate is a thermoplastic substrate.