Curable resin composition

• US 20070142528A1
• Filed: 12/21/2004
• Published: 06/21/2007
• Est. Priority Date: 12/22/2003
• Status: Active Grant

• Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha (TDK Corporation)
• Original Assignee: Denki Kagaku Kogyo Kabushiki Kaisha (TDK Corporation)
• Inventors: Oshima, Kazuhiro, Ogata, Yoichi
• Granted Patent: US 7,612,127 B2
• Time in Patent Office: Days
• US Class Current: 524/430
• CPC Class Codes: C08F 2/44 Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• CPC Class Codes: C08F 20/26 Esters containing oxygen in addition to the carboxy oxygen
• CPC Class Codes: C08F 230/085 the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 5/14 Peroxides
• CPC Class Codes: C08K 7/00 Use of ingredients characterised by shape
• CPC Class Codes: C09J 133/06 of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

It is to provide a curable resin composition which is curable at room temperature, has fluidity, is excellent in workability and provides a cured product having high thermal conductivity and being excellent in flexibility. A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm.

Claims

1. A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μ

m and from 30 to 70 μ

m, and the mode diameter is from 30 to 70 μ

m and the median diameter is from 5 to 40 μ

m.

3. The curable resin composition according to claim 1, which comprises from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer.

4. The curable resin composition according to claim 1, which further contains a drying oil.

6. The curable resin composition according to claim 4, which comprises from 1 to 30 parts by mass of the drying oil, from 0.5 to 10 parts by mass of the organic peroxide, from 0.1 to 10 parts by mass of the decomposition accelerator and from 100 to 1,500 parts by mass of the inorganic filler, respectively, per 100 parts by mass of the (meth)acrylate monomer.

7. The curable resin composition according to claim 1, wherein the inorganic filler is spherical alumina.

8. A cured product made of the curable resin composition as defined in claim 1.

9. A potting material made of the curable resin composition as defined in claim 1.

10. An adhesive made of the curable resin composition as defined in claim 1.

2. A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 0.2 to 1.5 μ

m, from 3 to 10 μ

m and from 30 to 70 μ

m, and the mode diameter is from 30 to 70 μ

m and the median diameter is from 5 to 40 μ

m.

5. The curable resin composition according to claim 2, which further contains a drying oil.