TEST METHOD OF MICROSCTRUCTURE BODY AND MICROMACHINE
First Claim
1. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
- supplying electric power to the microstructure body wirelessly through an antenna connected to the microstructure body; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body.
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Accused Products
Abstract
It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
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Citations
22 Claims
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1. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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supplying electric power to the microstructure body wirelessly through an antenna connected to the microstructure body; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body. - View Dependent Claims (9, 10, 11, 12, 13)
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2. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the microstructure body to a power supply circuit;
supplying electric power to the microstructure body and the power supply circuit wirelessly through an antenna connected to the microstructure body and the power supply circuit; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body.
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3. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the microstructure body to a power supply circuit;
supplying electric power to the microstructure body and the power supply circuit wirelessly through an antenna connected to the microstructure body and the power supply circuit; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body and the power supply circuit.
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4. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the microstructure body to a control circuit;
connecting the control circuit to a power supply circuit;
supplying electric power to the microstructure body, the control circuit, and the power supply circuit wirelessly through an antenna connected to at least one of the microstructure body, the control circuit, and the power supply circuit; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the microstructure body.
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5. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the first conductive layer to a first pad;
connecting the second conductive layer to a second pad;
supplying electric power to the microstructure body from the first pad and the second pad; and
detecting an electromagnetic wave generated from an antenna connected to the microstructure body as a characteristic of the microstructure body.
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6. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the first conductive layer to a first pad;
connecting the second conductive layer to a second pad;
supplying electric power to the microstructure body wirelessly through an antenna connected to the microstructure body; and
detecting a voltage applied to the microstructure body or a current flowing in the microstructure body as a characteristic of the microstructure body from the first pad and the second pad.
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7. A method for testing a microstructure body, comprising the steps of:
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connecting an antenna to a first microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer;
providing a second microstructure body having the same structure as that of the first microstructure body so as to be adjacent to the first microstructure body;
supplying electric power to the first microstructure body wirelessly through the antenna; and
detecting an electromagnetic wave generated from the antenna as a characteristic of the first microstructure body and evaluating a characteristic of the second microstructure body.
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8. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:
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connecting the first conductive layer to a first pad;
connecting the second conductive layer to a second pad;
supplying electric power to the microstructure body from the first pad and the second pad; and
detecting a current flowing in the microstructure body as a characteristic of the microstructure body.
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14. A method for testing a microstructure body, comprising the steps of:
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connecting a first antenna to a first microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer and having a known characteristic;
connecting a second microstructure body having the same structure as that of the first microstructure body to a second antenna having the same structure as that of the first antenna;
supplying electric power to the first microstructure body wirelessly through the first antenna;
detecting an electromagnetic wave generated from the first antenna as a reference characteristic of the second microstructure body;
supplying electric power to the second microstructure body wirelessly through the second antenna;
detecting an electromagnetic wave generated from the second antenna as a characteristic of the second the microstructure body; and
evaluating a characteristic of the second microstructure body by comparing the detected characteristic of the second microstructure body with the reference characteristic of the second microstructure body. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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Specification