Methods and systems for debonding substrates
First Claim
1. A method of separating two or more aircraft substrates bonded together by a bonding material, said method comprising:
- providing a substrate heating system, said substrate heating system comprising a remote heat source, and a remote thermal sensor;
remotely applying heat to at least one of said aircraft substrates, said bonding material or a combination thereof using said remote heat source;
remotely monitoring a temperature of at least one of said aircraft substrates during said application of heat using said remote thermal sensor;
manually or automatically controlling said application of heat based at least in part on said remotely monitored substrate temperature; and
separating at least one of said aircraft substrates from at least one other of said aircraft substrates during or after said application of heat.
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Accused Products
Abstract
Methods and systems for applying heat to substrates that are in contact with an uncured bonding material or that are bonded with one or more sealants or other bonding material/s. Substrates may be heated, for example, so that the substrates may be debonded by degrading one or more mechanical properties of the bonding material/s so that the substrates may be separated. The application of heat to a substrate may be controlled based on the temperature of the substrate during the heating process. Damage-sensitive substrates, such as aircraft substrates, may be heated in a manner that controls surface temperature of the substrates to meet heat treating requirements and/or to limit heating to maximum temperatures for the substrates in a manner that substantially eliminates damage to the substrates during the heating operation while at the same time at least partially curing uncured bonding material, or degrading one or more mechanical properties of cured bonding material/s.
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Citations
35 Claims
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1. A method of separating two or more aircraft substrates bonded together by a bonding material, said method comprising:
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providing a substrate heating system, said substrate heating system comprising a remote heat source, and a remote thermal sensor;
remotely applying heat to at least one of said aircraft substrates, said bonding material or a combination thereof using said remote heat source;
remotely monitoring a temperature of at least one of said aircraft substrates during said application of heat using said remote thermal sensor;
manually or automatically controlling said application of heat based at least in part on said remotely monitored substrate temperature; and
separating at least one of said aircraft substrates from at least one other of said aircraft substrates during or after said application of heat. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 13)
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9. A method of separating two or more substrates bonded together by a bonding material, said method comprising:
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remotely applying heat to at least one of said substrates, said bonding material or a combination thereof;
monitoring a temperature of at least one of said substrates during said application of heat;
controlling said application of heat in an automated manner based at least in part on said monitored substrate temperature; and
separating at least one of said substrates from at least one other of said substrates during or after said application of heat. - View Dependent Claims (10, 11, 12, 14, 15, 16, 17, 18)
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19. A substrate heating system, comprising:
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a heat source configured to remotely apply heat to a substrate;
a thermal sensor; and
a heat source control coupled to said heat source and to said thermal sensor, said heat source control being programmed with two or more different choices of substrate heating information, each of said two or more different choices corresponding to a type of substrate material composition to be heated by application of heat by said heat source of said substrate heating system;
wherein said heat source control is configured to allow a user to select one of said substrate heating information choices;
wherein said heat source control is further configured to automatically control application of heat to a substrate by said heat source based at least in part on temperature of said substrate monitored by said thermal sensor and based at least in part on said programmed substrate heating information selected by a user; and
wherein said heat source comprises a remote heat source, or wherein said thermal sensor comprises a remote thermal sensor, or a combination thereof. - View Dependent Claims (20, 21, 22, 23, 24)
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25. A method of heating a substrate bonded to a bonding material, said method comprising:
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remotely applying heat to said substrate or said bonding material;
monitoring a temperature of said substrate during said application of heat; and
controlling said application of heat in an automated manner based at least in part on said monitored substrate temperature to at least partially degrade one or more mechanical properties of said bonding material. - View Dependent Claims (26, 27, 28, 29)
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30. A method of heating a substrate in contact with a bonding material, said method comprising:
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applying heat to said substrate or said bonding material;
remotely monitoring a temperature of said substrate during said application of heat; and
wherein said bonding material is a cured bonding material in contact with said substrate and said method comprises controlling said application of heat based at least in part on said monitored substrate temperature to at least partially degrade one or more mechanical properties of said cured bonding material, or wherein said bonding material is an uncured bonding material in contact with said substrate and said method comprises controlling said application of heat based at least in part on said monitored substrate temperature to at least partially cure said uncured bonding material. - View Dependent Claims (31, 32, 33, 34, 35)
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Specification