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Semiconductor device

  • US 20070145420A1
  • Filed: 12/15/2006
  • Published: 06/28/2007
  • Est. Priority Date: 12/15/2005
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate comprising a front surface and a back surface;

    a light receiving element formed on the front surface of the semiconductor substrate;

    a transparent substrate attached to the front surface of the semiconductor substrate so as to cover the light receiving element;

    a wiring layer formed on the back surface of the semiconductor substrate; and

    a reflection layer formed on the back surface of the semiconductor substrate and located between the light receiving element and the wiring layer, the reflecting layer being configured to reflect an infrared ray passing through the transparent substrate, the light receiving element and the semiconductor substrate back toward to the light receiving element.

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