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SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

  • US 20070145587A1
  • Filed: 03/31/2006
  • Published: 06/28/2007
  • Est. Priority Date: 12/22/2005
  • Status: Abandoned Application
First Claim
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1. A substrate with multi-layer interconnection structure, comprising:

  • a substrate; and

    a multi-layer interconnection structure formed on the substrate, wherein the multi-layer interconnection structure is adhered to the substrate in partial areas.

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