ELECTROSTATIC CHUCK

• US 20070146961A1
• Filed: 12/18/2006
• Published: 06/28/2007
• Est. Priority Date: 12/22/2005
• Status: Abandoned Application

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Kawajiri, Tetsuya, Morioka, Ikuhisa, Torigoe, Takeru, Tsuruta, Hideyoshi
• Application Number:
  US11/611,905
• Publication Number:
  US 20070146961A1
• Time in Patent Office: Days
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

An electrostatic chuck includes: a base body; an electrode formed on the base body and generating coulomb force; and a dielectric layer formed on the base body and electrode, having a plurality of projections on a first main face on the side supporting a substrate attracted by the coulomb force, and supporting the substrate on the upper surfaces of these projections. The projections are arranged at substantially uniform intervals. The surface roughness (Ra) of the projection upper faces is 0.5 μm or smaller. The height of the projections is 5 to 20 μm. The relation A^1/2×B²>200 is satisfied where A (number/100 cm²) is the number of the projections per unit area of 100 cm² in the first main face, and B (μm) is the height of the projections.

Claims

1. An electrostatic chuck comprising:

a base body;

an electrode formed on the base body and generating coulomb force; and

a dielectric layer formed on the base body and the electrode, having a plurality of projections on a first main face on a side supporting a substrate attracted by the coulomb force, and supporting the substrate on upper faces of these projections,

wherein the projections are arranged at substantially uniform intervals,

surface roughness (Ra) of the upper faces of the projections is not greater than 0.5 μ

m,

height of the projections is 5 to 20 μ

m, and

a relation of a following expression is satisfied;

A^1/2×

B²>

200, where A (number/100 cm²) is the number of the projections per unit area of 100 cm² on the first main face, and B (μ

m) is the height of the projections.

2. The electrostatic chuck according to claim 1, wherein the height of the projections is not greater than 10 μ

m.

3. The electrostatic chuck according to claim 1, wherein diameter of the upper faces of the projections is not greater than 2.0 mm.

4. The electrostatic chuck according to claim 1, wherein the dielectric layer comprises at least one of alumina, aluminum nitride, yttria, boron nitride, silicon nitride, and silicon carbide.

5. The electrostatic chuck according to claim 1, wherein volume resistivity of the dielectric layer at room temperature is not smaller than 1×

10¹⁵ Ω

·

cm.

6. The electrostatic chuck according to claim 1, wherein thickness of the dielectric layer is 0.05 to 0.5 mm.

7. The electrostatic chuck according to claim 1, wherein a backside gas is introduced into a space between the substrate and the first main face.