Device for cooling an electrical component and production method thereof

• US 20070147009A1
• Filed: 11/16/2004
• Published: 06/28/2007
• Est. Priority Date: 11/18/2003
• Status: Abandoned Application

• Current Assignee: Valeo Electronique et Systems de Liaison
• Original Assignee: Valeo Electronique et Systems de Liaison
• Inventors: Morelle, Jean-Michel, Vivet, Laurent
• Application Number:
  US10/579,624
• Publication Number:
  US 20070147009A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

In a device for cooling an electrical component and to the production method thereof, the inventive device includes a metallic radiator-forming member which is thermally connected to a metallic mass of the component that forms a heat-dissipating mass. The radiator is thermally connected to the dissipating mass by at least one heat sink which is formed by an autogenous weld between one face of the dissipating mass, known as the dissipating face, and one face of the radiator, which are facing one another. The invention can be used to cool electronic components, for example, in power electronic modules.

Claims

1. A device for cooling an exothermic electrical component, of the type comprising a metal member forming a radiator thermally coupled to a metal mass of the component forming a heat dissipating mass of the component, wherein the radiator is thermally coupled to the dissipating mass by at least one heat sink formed by an autogenous weld between one face of the dissipating mass, called the dissipating face, and one face of the radiator, opposite each other.

2. The device as claimed in claim 1, in which at least one element among the dissipating mass and the radiator is made from copper.

3. The device as claimed in claim 1, in which the component comprises at least one heat source and in which the heat sink is aligned with this source substantially parallel to a direction perpendicular to the dissipating face.

4. The device as claimed in claim 3, in which the heat source comprises a semiconductor.

5. The device as claimed in claim 1, in which the area of the dissipating face included in the heat sink corresponds to at least 5% of the area of the dissipating face.

6. The device as claimed in claim 1, in which the sink also forms a means for fixing the component to the radiator.

7. The device as claimed in claim 1, in which the sink also forms a means of electrical conduction between the component and the radiator.

8. The device as claimed in claim 1, in which the radiator has a plate shape and is provided with one large face opposite the dissipating mass and one large face, opposite to the preceding face, bearing on a support.

9. The device as claimed in claim 8, in which the support is made from a material transparent to a wavelength of a laser welding head.

10. The device as claimed in claim 8, in which the radiator is provided with two small opposed faces connected by overmolding of material, preferably of plastic, to two substantially parallel electrically conducting bars.

11. The device as claimed in claim 1, comprising a plurality of heat sinks.

12. A method for producing a device as claimed in claim 11, wherein a set of heat sinks is formed by autogenous welding in two steps during each of which one subset of sinks is formed, these two steps being separated by a step of fixing the component to a support separate from the radiator.

13. The method as claimed in claim 12, wherein the autogenous welding is carried out using a laser welding head.

14. The method as claimed in claim 13, wherein the device is a device for cooling an exothermic electrical component, of the type comprising a metal member forming a radiator thermally coupled to a metal mass of the component forming a heat dissipating mass of the component, wherein the radiator is thermally coupled to the dissipating mass by at least one heat sink formed by an autogenous weld between one face of the dissipating mass, called the dissipating face, and one face of the radiator, opposite each other, in which the sink also forms a means for fixing the component to the radiator, in which the sink also forms a means of electrical conduction between the component and the radiator, in which the radiator has a plate shape and is provided with one large face opposite the dissipating mass and one large face, opposite to the preceding face, bearing on a support, and in which the support is made from a material transparent to a wavelength of a laser welding head, in which the autogenous welding is carried out through the support.

15. The method as claimed in claim 12, wherein the autogenous welding is carried out using a vacuum electron beam.