Backlight module with a heat conductive block

• US 20070147080A1
• Filed: 05/12/2006
• Published: 06/28/2007
• Est. Priority Date: 12/23/2005
• Status: Abandoned Application

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Lo, Chi-chung, Hsieh, Chin-kun, Cheng, Chi-chen, Wu, Meng-chai, Lai, Cheng-chih
• Application Number:
  US11/433,093
• Publication Number:
  US 20070147080A1
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.

Claims

1. A backlight module, comprising:

a bezel having at least one edge;

a circuit board;

one or more light emitting diodes connected to the circuit board, each light emitting diode comprising a light axis, wherein the light axis of each light emitting diode is neither parallel nor vertical to the edge of the bezel; and

a non-rectangle heat conductive block disposed between the bezel and the light emitting diode, for transferring heat generated by the light emitting diode to the bezel.

2. The backlight module of claim 1, wherein the bezel is made of metal.

3. The backlight module of claim 1, wherein the circuit board is a flexible print circuit board.

4. The backlight module of claim 1, wherein the non-rectangle heat conductive block is made of metal.

5. The backlight module of claim 1, wherein the non-rectangle heat conductive block, the circuit board, and the bezel are adhered with a high polymer having high thermal conductivity.

6. The backlight module of claim 1, wherein the non-rectangle heat conductive block is attached to the bezel.

7. A liquid crystal display incorporating the backlight module of claim 1.

8. The backlight module of claim 1, further comprising a light guide plate with a patterned surface.