Camera modules with liquid optical elements

• US 20070147816A1
• Filed: 12/27/2005
• Published: 06/28/2007
• Est. Priority Date: 12/27/2005
• Status: Abandoned Application

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Humpston, Giles, Honer, Kenneth
• Application Number:
  US11/318,874
• Publication Number:
  US 20070147816A1
• Time in Patent Office: Days
• US Class Current: 396/72
• CPC Class Codes: G02B 26/005 based on electrowetting
• CPC Class Codes: G02B 3/14 of variable focal length
• CPC Class Codes: G03B 17/00 Details of cameras or camera bodies; Accessories therefor lens hoods or caps G03B11/04
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.

Claims

1. A camera module comprising:

(a) an optoelectronic sensor including a body having a front surface and an array of optically sensitive elements arranged so that light impinging on said front surface will pass to said optically sensitive elements; and

(b) a lens assembly including a first liquid in contact with said front surface of said body.

2. A camera module as claimed in claim 1 further comprising an element having index of refraction different from the index of refraction of said first liquid forming a proximal refractive interface with said first liquid.

3. The camera module of claim 2 wherein said element includes a second liquid having an index of refraction different from said first liquid, said first and second liquids forming a meniscus therebetween, said meniscus constituting said proximal refractive interface.

4. The camera module of claim 3 further comprising electrodes in proximity to said first and second liquids, said electrodes and said liquids being arranged so that the curvature of said meniscus can be altered by varying an electrical potential between said electrodes.

5. The camera module of claim 4 further comprising a container having a container wall defining a space extending to said front surface and a closure extending across said space remote from said front surface, said first and second liquids being disposed within said space with said first liquid in contact with said front surface of said sensor body and said second liquid in contact with said closure.

6. The camera module as claimed in claim 4 further comprising an additional lens, said proximal refractive interface being disposed between said additional lens and said front surface of said optoelectronic sensor.

7. The camera module of claim 2 wherein said body of said optoelectronic sensor includes a semiconductor chip incorporating said sensors and a transparent cover overlying said chip and defining said front surface.

8. The camera module of claim 7 wherein said cover has an inner surface facing toward said chip and an outer surface facing away from said chip, the module further comprising a container wall projecting from said outer surface and extending away from said chip, said container wall and said cover defining a space, said first liquid being disposed within said space.

9. The camera module of claim 8 wherein said second element includes a second liquid disposed within said space, said second liquid having an index of refraction different from said first liquid, said liquids forming a meniscus therebetween, said meniscus constituting said proximal refractive interface, the module further comprising electrodes in proximity to said first and second liquids, said electrodes and said liquids being arranged so that the curvature of said meniscus can be altered by varying an electrical potential between said electrodes.

10. The camera module of claim 9 wherein at least one of said electrodes is mounted to said container wall.

11. The camera module of claim 9 wherein said container wall is integral with said cover.

12. The camera module of claim 9 or claim 10 or claim 11 further comprising electrically conductive terminals carried by said cover, at least some of said terminals being electrically connected to said chip.

13. The camera module of claim 12 wherein at least one of said terminals is electrically connected to at least one of said electrodes.

14. The camera module of claim 12 wherein said container wall projects in a central region of said front surface and said terminals are disposed in a peripheral region of said front surface outside of said central region.

15. The camera module of claim 14 wherein said terminals are adapted for surface-mounting to a circuit panel.

16. The camera module as claimed in claim 7 wherein said chip includes an active region incorporating said sensing elements and wherein said inner surface of said cover is spaced from said active region of said chip.

17. A camera module comprising:

(a) a structure including;

(i) an optoelectronic sensor including a body having a front surface and an array of optically sensitive elements arranged so that light impinging on said front surface will pass to said optically sensitive elements, said sensor further including circuitry connected to said optically sensitive elements; and

(ii) a container including two immiscible liquids having different indices of refraction and electrodes in proximity to said liquids, said electrodes and said liquids being arranged so that the curvature of said meniscus can be altered by varying an electrical potential between said electrodes, said container being aligned with said sensor so that light passing to said sensor passes through said meniscus; and

(b) terminals mounted to said structure, at least some of said terminals being electrically connected to said electrodes and at least some of said terminals being electrically connected to said circuitry.

18. A module as claimed in claim 17 wherein said terminals are adapted for surface mounting to a circuit panel.

19. A module as claimed in claim 17 wherein said sensor body includes a chip having said sensors and said circuitry and a cover overlying a surface of said chip, and wherein said terminals are carried by said cover.

20. A module as claimed in claim 17 wherein said sensor body includes a chip having said sensors and said circuitry and wherein said terminals are carried by said chip.

21. A method of manufacturing a plurality of camera modules comprising:

(a) assembling a container element including a plurality of containers with a wafer element including a plurality of image sensor chips so that said containers are aligned with sensing elements of said chips; and

(b) filling each of said containers with two immiscible liquids having different indices of refraction to thereby form a meniscus, said meniscus defining a refractive interface; and

(c) severing said container element and said wafer element to thereby form a plurality of individual units, each including one of said image sensor chips and one of said containers.

22. The method as claimed in claim 21 wherein said severing step is performed before filling said containers.

23. The method as claimed in claim 21 wherein said container element includes a plurality of covers, each having an inner surface, an outer surface and a container wall projecting from said outer surface, said assembling step including assembling said covers with said chips so that said covers and chips form sensors having front surfaces defined by said covers, with said container walls projecting from said front surfaces.