Method and apparatus for laser-drilling an inkjet orifice in a substrate

• US 20070148567A1
• Filed: 12/09/2005
• Published: 06/28/2007
• Est. Priority Date: 12/09/2005
• Status: Abandoned Application

• Current Assignee: Coherent Inc (Coherent Corp.)
• Original Assignee: Coherent Inc (Coherent Corp.)
• Inventors: Shimizu, Hiroshi, Ferber, Joerg
• Application Number:
  US11/298,281
• Publication Number:
  US 20070148567A1
• Time in Patent Office: Days
• US Class Current: 430/30
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/384 of specially shaped holes
• CPC Class Codes: B23K 26/389 of fluid openings, e.g. nozzles, jets laser machining of inkjet nozzles B41J2/1634
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: B41J 2002/14475 characterised by nozzle shapes or number of orifices per chamber

Abstract

An inkjet aperture in a substrate has a compound cross-section including a circular portion and an elongated trough-shaped portion. The aperture is formed in the substrate by laser drilling. A laser beam is projected on a mask having circular apertures corresponding to the circular portion of the inkjet aperture cross-section. An image of the mask is projected by a lens onto the substrate while reciprocally tilting a tiltable plate between the mask and the lens. This forms the trough-shaped portion of the aperture. The tiltable plate is then replaced by a fixed plate of equal thickness and the circular portion of the aperture is drilled to complete the aperture.

Claims

1. A method of drilling an aperture in a substrate, the aperture having a compound cross-section comprising first and second cross-section portions, the method comprising the steps of:

illuminating a mask with a sequence of laser pulses, said mask having an aperture therein having a shape corresponding to the shape of the second cross-section portion;

using a projection lens, projecting a sequence of images of said mask aperture on the substrate corresponding to said sequence of laser pulses illuminating the mask;

drilling the first cross-section portion of the aperture by locating a first transparent plate in an optical path of said laser pulses between said mask and said projection lens, and varying the tilt angle of said first transparent plate with respect to said optical path such that said mask-aperture images from said sequence thereof are scanned to different overlapping locations over the substrate; and

drilling the second cross-section portion of the aperture by locating a second transparent plate, instead of said first transparent plate, in the optical path between the mask and the projection lens, said second transparent plate having a fixed alignment with said optical path such that mask-aperture images from said sequence thereof are formed in a fixed location on the substrate, and said second transparent plate having about the same optical thickness as said first transparent plate such that the optical distance between said mask and said projection lens is about the same whichever of said first and second transparent plates is located in said optical path.

2. The method of claim 1, wherein said fixed alignment of said second transparent plate is perpendicular to said optical path.

3. The method of claim 2, wherein the tilt angle of said first optical plate is varied reciprocally and linearly.

4. The method of claim 3, wherein said mask aperture is circular, said first cross-section portion of the aperture has an elongated trough-shaped cross-section, and said second cross-section portion of the aperture has a circular cross-section

5. The method of claim 4, wherein pulses in said sequence are delivered at a frequency about 10 or more times greater than the reciprocal variation rate of said first transparent plate.

6. The method of claim 1, wherein the aperture is one of a plurality of essentially identical apertures to be drilled in the substrate, said mask has a plurality of essentially identical apertures therein corresponding to said plurality of apertures to be drilled in the substrate, and wherein said first portions of said substrate apertures are simultaneously drilled, and said second portions of said substrate apertures are simultaneously drilled.

7. A method of drilling an aperture in a substrate, the aperture having a compound cross-section comprising first and second cross-section portions, with the first cross-section portion being an elongated form of the second cross-section portion, the method comprising the steps of:

illuminating a mask with a sequence of laser pulses, said mask having an aperture therein having a shape corresponding to the shape of the second cross-section portion;

using a projection lens, projecting a sequences of images of said mask aperture on the substrate corresponding to said sequence of laser pulses illuminating said mask;

drilling the first cross-section portion of the aperture by locating a tiltable transparent plate in an optical path of said laser pulses between said mask and said projection lens, and reciprocally tilting said plate such that said mask-aperture images from said sequence thereof are scanned linearly in an overlapping manner over the substrate; and

drilling the second cross-section portion by locating a fixed transparent plate having about the same optical thickness as the tiltable transparent plate, instead of said tiltable transparent plate, in said optical path between said mask and said projection lens, such that mask-aperture images from said sequence thereof are formed in a fixed location on the substrate.

8. The method of claim 7, wherein said sequence of pulses is delivered at a pulse repetition frequency at least about ten times greater than the reciprocation frequency of said tiltable plate.

9. The method of claim 7, wherein said fixed plate is reciprocally tilted by an angle to said optical path no greater than about 5 degrees on either side of a central alignment angle.

10. The method of claim 9, wherein said fixed plate is fixedly aligned to said optical path at said central alignment angle.

11. The method of claim 10, wherein said central alignment angle is perpendicular to said optical path.

12. The method of claim 7, wherein said first cross-section portion of the aperture is drilled prior to drilling said second cross-section portion of the aperture.

13. The method of claim 7, wherein the said mask aperture is circular, the first cross-section portion has an elongated trough-shape, and the second cross-section portion has a circular cross-section.

14. Laser apparatus for drilling an aperture in a substrate, comprising:

a mask having an aperture therein having a shape corresponding to a cross-section shape of the aperture;

a laser arranged to deliver a sequence of laser pulses;

optics arranged to receive said sequence of pulses and direct said sequence of laser pulses to the mask for illuminating the mask;

an imaging lens arranged to project a sequences of images of said mask aperture on the substrate, said sequence of images corresponding to said sequence of laser pulses illuminating said mask;

first and second transparent plates alternatively locatable in an optical path of said laser pulses between said mask and said imaging lens;

said first plate having a fixed alignment with respect to said optical path such that when said first plate is located in said optical path mask-images from said sequence thereof are incident in the same location on said substrate;

said second plate having a tiltably mounted with respect to said optical path such that when said second plate is located in said optical path and said plate is tilted through a range of angles, mask-images from said sequence thereof are scanned to different locations on said substrate; and

wherein each of said first and second plates has about the same optical thickness, such that the optical distance from said mask to said imaging lens is about the same whichever of said plates is located in said optical path.

15. The apparatus of claim 14, wherein said second plate has a reciprocally variable tilt angle with respect to said optical path and configured such that scanned images are reciprocally, linearly scanned over said substrate.

16. The apparatus of claim 15, wherein said first and second plates are mounted on a platform translatable in a direction transverse to said optical path for alternatively locating one or the other thereof in said optical path.

17. The apparatus of claim 15, wherein said aperture in said mask is one of a plurality of identical apertures in said mask.

18. A mechanism for scanning a laser beam in order to drill a workpiece comprising:

a carrier;

a first transparent plate tiltably mounted on said carrier;

means for causing the tiltable plate to reciprocate;

a second transparent plate fixedly mounted on said carrier, said second transparent plate having the same optical thickness as the first transparent plate; and

means for moving the carrier to selectively align one of the first and second plates with the laser beam whereby in operation, the carrier is positioned to align the first tiltable plate with the laser beam so that when the plate is reciprocated, the laser beam will be scanned over the workpiece to drill the first portion of a hole to first depth and an extended width and thereafter the carrier is positioned to align the second fixed plate with the laser beam in order to drill a second portion of the hole deeper into the workpiece, said second portion of the hole being located within the area of the first portion of the hole and having a smaller diameter than the first portion of the hole.