Method of forming self-aligned double pattern
First Claim
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1. A method of forming a self-aligned double pattern, comprising:
- providing a substrate;
forming an underlying layer on the substrate;
forming a first mask pattern on the underlying layer;
forming a first sacrificial layer on the first mask pattern and the underlying layer;
forming a second mask pattern on the first sacrificial layer;
etching the first sacrificial layer to form a first sacrificial pattern;
forming a second sacrificial layer on the first mask pattern, the second mask pattern, and the underlying layer;
planarizing the second sacrificial layer such that top surfaces of the first mask pattern and the second mask pattern are planar;
removing the second sacrificial layer; and
forming an underlying layer pattern by etching the underlying layer using the first mask pattern, the second mask pattern, and the first sacrificial pattern as an etching mask.
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Abstract
Mask patterns used for forming patterns or trenches may include first mask patterns, which may be formed by a typical photolithography process, and second mask patterns, which may be formed in a self-aligned manner between adjacent first mask patterns. A sacrificial layer may be deposited and planarized such that the tops of the first mask patterns and the second mask patterns have planar surfaces. After the planarization of the sacrificial layer, the remaining the sacrificial layer may be removed by an ashing process.
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Citations
19 Claims
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1. A method of forming a self-aligned double pattern, comprising:
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providing a substrate; forming an underlying layer on the substrate; forming a first mask pattern on the underlying layer; forming a first sacrificial layer on the first mask pattern and the underlying layer; forming a second mask pattern on the first sacrificial layer; etching the first sacrificial layer to form a first sacrificial pattern; forming a second sacrificial layer on the first mask pattern, the second mask pattern, and the underlying layer; planarizing the second sacrificial layer such that top surfaces of the first mask pattern and the second mask pattern are planar; removing the second sacrificial layer; and forming an underlying layer pattern by etching the underlying layer using the first mask pattern, the second mask pattern, and the first sacrificial pattern as an etching mask. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a self-aligned double pattern, comprising:
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providing a substrate; forming a first mask pattern on the substrate; forming a first sacrificial layer on the first mask pattern and the substrate; forming a second mask pattern on the first sacrificial layer; etching the first sacrificial layer to form a first sacrificial pattern; forming a second sacrificial layer on the first mask pattern, the second mask pattern, and the substrate; planarizing the second sacrificial layer such that top surfaces of the first mask pattern and the second mask pattern are planar; removing the second sacrificial layer; and forming a trench by an etching process using the first mask pattern and the second mask pattern as an etching mask. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification