Stimulator leads and methods for lead fabrication

• US 20070150036A1
• Filed: 12/27/2005
• Published: 06/28/2007
• Est. Priority Date: 12/27/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: Anderson, Meredith
• Granted Patent: US 8,700,178 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: Y10T 29/4921 with bonding
• CPC Class Codes: Y10T 29/4922 with molding of insulation

Abstract

A lead for a stimulation device can include an array of electrodes with each electrode having a front surface and a back surface; a plurality of conductors; a carrier formed around the array of electrodes; and a biocompatible material that may be disposed over and/or joined with the carrier and the back surfaces of the electrodes. A conductor is attached to the back surface of each electrode. The carrier can be formed around the array of electrodes, but does not completely cover the front surface or back surface of the electrodes.

Claims

1. A method of making a lead for a stimulation device comprising:

forming an array of electrodes in a pre-determined arrangement;

forming a carrier around the array of electrodes to maintain the arrangement; and

disposing a biocompatible material over at least a portion of the carrier to form an array body comprising the array, the carrier, and the biocompatible material.

2. The method of claim 1, wherein forming the array of electrodes in a pre-determined arrangement comprises positioning the electrodes in a carrier mold.

3. The method of claim 2, wherein the carrier mold comprises electrode positioning features.

4. The method of claim 3, wherein the electrode positioning features are depressions in the carrier mold.

5. The method of claim 1, wherein forming a carrier comprises molding a carrier around the array of electrodes.

6. The method of claim 1, further comprising attaching conductors to the array of electrodes.

7. The method of claim 6, further comprising applying an adhesive to the conductors attached to the array of electrodes.

8. The method of claim 1, wherein disposing the biocompatible material comprises molding the biocompatible material over at least a portion of the carrier.

9. The method of claim 1, wherein disposing the biocompatible material comprises disposing the biocompatible material over substantially all of at least one surface of the carrier.

10. The method of claim 6, wherein disposing the biocompatible material comprises disposing the biocompatible material over the portion of the carrier on which the conductors are located.

11. The method of claim 6, wherein attaching conductors to the array of electrodes occurs before disposing a biocompatible material over at least a portion of the carrier.

12. The method of claim 7, wherein applying an adhesive to the conductors attached to the array of electrodes occurs before disposing a biocompatible material over at least a portion of the carrier.

13. The method of claim 1, wherein a material of the carrier and the biocompatible material are a same material.

14. The method of claim 13, wherein the carrier and the biocompatible material have a different durometer.

15. A lead for a stimulation device comprising:

an array of electrodes, each electrode having a front surface and a back surface;

a plurality of conductors, wherein one of the conductors is attached to the back surface of one of the electrodes;

a carrier formed around the array of electrodes but not completely covering the front surface or back surface of the electrodes; and

a biocompatible material disposed over, and in contact with, the carrier and the back surface of the electrodes,

wherein the carrier and the biocompatible material are different.

16. The lead of claim 15, wherein a material of the carrier and the biocompatible material are different.

17. The lead of claim 15, wherein the carrier and the biocompatible material have a different durometer.

18. A system for stimulation comprising:

an electronic subassembly;

a lead comprising an array of electrodes wherein each electrode has a front surface and a back surface;

a carrier formed around the array of electrodes but not completely covering the front surface or back surface of the electrodes; and

a biocompatible material disposed over, and in contact with, the carrier and the back surface of the electrodes, wherein the carrier and the biocompatible material are different; and

a plurality of conductors, wherein a one of the conductors is attached to the back surface of each electrode, and wherein the conductors couple the electrodes to the electronic subassembly.

19. The system for stimulation of claim 18, wherein a material of the carrier and the biocompatible material are different.

20. The system for stimulation of claim 18, wherein the carrier and the biocompatible material have a different durometer.