Method and apparatus for cooling electrical equipment

• US 20070151707A1
• Filed: 12/31/2005
• Published: 07/05/2007
• Est. Priority Date: 12/31/2005
• Status: Abandoned Application

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Hodes, Marc, Lyons, Alan, O'Loughlin, Alan, Scofield, William
• Application Number:
  US11/323,308
• Publication Number:
  US 20070151707A1
• Time in Patent Office: Days
• US Class Current: 165/104.210
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20572 within cabinets for removing heat from sub-racks, e.g. plenum
• CPC Class Codes: H05K 7/20681 within cabinets for removing heat from sub-racks

Abstract

A method is provided for cooling electrical equipment located in distinct regions in a cabinet. A first air flow is provided to a first region in the cabinet. A second air flow is provided to a second region in the cabinet. The temperature of the first and second air flows provided to the first and second regions is substantially equalized to provide similar cooling characteristics within the first and second regions. The equalization is accomplished via a heat exchanger arrangement that may be an active or passive system.

Claims

1. A method, comprising:

providing a first air flow to a first region in a cabinet;

providing a second air flow to a second region in a cabinet; and

substantially equalizing the temperature of the first and second air flows provided to the first and second regions.

2. A method, as set forth in claim 1, wherein substantially equalizing the temperature of the first and second air flows provided to the first and second regions further comprises transferring heat from the first air flow to the second air flow.

3. A method, as set forth in claim 1, wherein substantially equalizing the temperature of the first and second air flows provided to the first and second regions further comprises transferring heat from one of the first and second air flows having the higher temperature to the other of the first and second air flows having the lower temperature.

4. A method, as set forth in claim 1, wherein substantially equalizing the temperature of the first and second air flows provided to the first and second regions further comprises transferring heat from the first air flow to the second air flow to urge the temperatures of the first and second air flows toward a common temperature.

5. A method, comprising:

providing a first air flow to a first region in a cabinet;

providing a second air flow to a second region in a cabinet; and

transferring heat from the first air flow to the second air flow.

6. A method, as set forth in claim 5, wherein transferring heat from the first air flow to the second air flow further comprises the first and second air flows having a temperature differential therebetween and wherein transferring heat from the first air flow to the second air flow reduces the temperature differential.

7. A method, as set forth in claim 5, wherein transferring heat from the first air flow to the second air flow further comprises the first and second air flows having a temperature differential therebetween and wherein transferring heat from the first air flow to the second air flow substantially eliminates the temperature differential.

8. A method, as set forth in claim 5, wherein transferring heat from the first air flow to the second air flow further comprises substantially equalizing the temperatures of the first and second air flows.

9. A method, as set forth in claim 5, wherein providing the first air flow to the first region in the cabinet further comprises providing the second air flow via an external input directly to the first region.

10. A method, as set forth in claim 9, wherein providing the second air flow to the second region in the cabinet further comprises providing the second air flow via an external input directly to the second region.

11. A method, as set forth in claim 9, wherein providing the second air flow to the second region in the cabinet further comprises providing the second air flow from the first region.

12. An apparatus, comprising:

a cabinet have a first region and a second region and at least one inlet adapted to receive an air flow and pass a first air flow to the first region and a second air flow to the second region; and

a heat exchanger positioned to receive the first and second air flows and transfer heat therebetween.

13. An apparatus, as set forth in claim 12, wherein the heat exchanger further comprises a first heat exchanger positioned to receive the first air flow and a second heat exchanger positioned to receive the second air flow.

14. An apparatus, as set forth in claim 13, wherein the first and second heat exchangers are coupled together in a passive system.

15. An apparatus, as set forth in claim 14, wherein the passive system comprises a heat pipe.

16. An apparatus, as set forth in claim 13, wherein the first and second heat exchangers are coupled together in an active system.

17. An apparatus, as set forth in claim 16, wherein the active system comprises a pump-based fluid circulation system.

18. An apparatus, as set forth in claim 12, wherein said inlet is located adjacent a bottom region of the cabinet.

19. An apparatus, as set forth in claim 12, wherein said inlet is located adjacent a top region of the cabinet.

20. An apparatus, as set forth in claim 12, wherein said inlet comprises first and second inlets located adjacent said first and second regions respectively.