APPARATUS FOR REACTIVE SPUTTERING

• US 20070151842A1
• Filed: 12/14/2006
• Published: 07/05/2007
• Est. Priority Date: 12/15/2005
• Status: Abandoned Application

• Current Assignee: Veeco Instruments Incorporated
• Original Assignee: Fluens Corporation (Veeco Instruments Incorporated)
• Inventors: Klein, Martin, Sferlazzo, Piero, DeVito, Richard
• Application Number:
  US11/610,665
• Publication Number:
  US 20070151842A1
• Time in Patent Office: Days
• US Class Current: 204/192.100
• CPC Class Codes: C23C 14/0052 Bombardment of substrates by reactive ion beams
• CPC Class Codes: C23C 14/0073 by exposing the substrates to reactive gases intermittently
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/46 by ion beam produced by an external ion source
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01J 2237/2006 Vacuum seals
• CPC Class Codes: H01J 2237/202 Movement
• CPC Class Codes: H01J 2237/3146 Ion beam bombardment sputtering
• CPC Class Codes: H01J 37/185 Means for transferring objects between different enclosures of different pressure or atmosphere
• CPC Class Codes: H01J 37/3178 for applying thin layers on objects
• CPC Class Codes: H01J 37/3233 using charged particles
• CPC Class Codes: H01J 37/32761 Continuous moving
• CPC Class Codes: H01J 37/34 operating with cathodic sputtering H01J37/36 takes precedence ; methods of cathodic sputtering C23C14/34

Abstract

A reactive sputtering system includes a vacuum chamber and a reactive ion source that is positioned inside the vacuum chamber. The reactive ion source generates a reactive ion beam from a reactant gas. A sputtering chamber is positioned in the vacuum chamber. The sputtering chamber includes a sputter source having a sputtering target that generates sputtering flux, walls that contain an inert gas, and a seal that impedes the reactant gas from entering into the sputtering chamber and that impedes inert gas and sputtered material from escaping into the vacuum chamber. A transport mechanism transports a substrate under the reactive ion source and through the sputtering chamber. The substrate is exposed to the reactive ion beam while passing under the reactive ion source and then is exposed to sputtering flux while passing through the sputtering chamber.

Claims

1. A reactive sputtering system comprising:

a) a vacuum chamber;

b) a reactive ion source that is positioned inside the vacuum chamber, the reactive ion source generating a reactive ion beam from a reactant gas;

c) a sputtering chamber that is positioned in the vacuum chamber, the sputtering chamber comprising a sputter source having a sputtering target that generates sputtering flux, walls that contain an inert gas, and a seal that impedes the reactant gas from entering into the sputtering chamber and that impedes inert gas and sputtered material from escaping into the vacuum chamber; and

d) a transport mechanism that transports a substrate under the reactive ion source and through the sputtering chamber, the substrate being exposed to the reactive ion beam while passing under the reactive ion source and being exposed to sputtering flux while passing through the sputtering chamber.

2. The reactive sputtering system of claim 1 wherein the reactive ion source comprises a radical ion source that is remotely positioned relative to the vacuum chamber.

3. The reactive sputtering system of claim 1 wherein the reactive ion source comprises a grid for extracting the reactive ion beam at a predetermined energy.

4. The reactive sputtering system of claim 1 wherein the reactive ion source comprises a gridless ion source.

5. The reactive sputtering system of claim 1 wherein the reactive ion source comprise a linear ion source.

6. The reactive sputtering system of claim 1 wherein the reactive ion source comprises a combination of at least two circular ion sources with a desired overlapping ion beam pattern.

7. The reactive sputtering system of claim 1 wherein the seal comprises a sliding seal.

8. The reactive sputtering system of claim 1 wherein the seal comprises a gas curtain seal.

9. The reactive sputtering system of claim 1 further comprising a vacuum pump that is positioned with an input inside the sputtering chamber, wherein the vacuum pump controls a pressure inside the sputtering chamber.

10. The reactive sputtering system of claim 1 wherein the seal is differentially pumped.

11. The reactive sputtering system of claim 1 wherein the seal comprises an inner wall and an outer wall containing a volume of gas.

12. The reactive sputtering system of claim 11 further comprising a vacuum pump that is coupled to the volume of gas between the inner wall and the outer wall of the seal so as to evacuate the volume of gas to a desired pressure.

13. The reactive sputtering system of claim 1 wherein the sputtering source comprises a magnetron sputtering source.

14. The reactive sputtering system of claim 1 wherein the sputtering target comprise a metal sputtering target.

15. The reactive sputtering system of claim 1 wherein the transport mechanism comprises a rotating disk that supports at least one substrate to be processed.

16. The reactive sputtering system of claim 1 wherein the sputtering chamber comprises a delta shaped chamber.

17. The reactive sputtering system of claim 1 further comprising an aperture positioned in a path of the sputtering flux that improves uniformity of the deposited sputtered material.

18. The reactive sputtering system of claim 1 further comprising a collimator positioned between the sputtering target and the substrate, the collimator controlling the direction of the sputtering flux.

19. A method of reactive sputtering, the method comprising:

a) generating a reactive ion beam from a reactive gas in a vacuum chamber;

b) containing an inert gas within a sputter source positioned inside the vacuum chamber so as to impede the reactant gas from entering into the sputter source;

c) generating sputtering flux from the inert gas contained within the sputter source; and

d) transporting a substrate through the reactive ion beam and through the sputtering flux in the sputter source, thereby reacting the reactive ions with sputtered material deposited on the substrate.

20. The method of claim 19 wherein the generating the reactive ion beam comprises generating an oxygen ion beam that performs at least one of oxidation and densification of the deposited sputtered material.

21. The method of claim 19 wherein the generating the reactive ion beam comprises generating an oxygen and argon ion beam that perform at least one of oxidation and densification of the deposited sputtered material.

22. The method of claim 19 wherein the generating the sputtering flux comprises generating metal sputtering flux.

23. The method of claim 22 wherein the metal sputtering flux comprises aluminum sputtering flux.

24. The method of claim 19 further comprising pre-cleaning the substrate with the reactive ion beam to active the substrate for deposition of the sputtered material.

25. The method of claim 19 further comprising selecting at least one of an energy of reactive ions in the reactive ion beam and a current density of the reactive ion beam to obtain a desired stress of the deposited sputtered material.

26. The method of claim 19 further comprising selecting at least one of an energy of reactive ions in the reactive ion beam and a current density of the reactive ion beam to reduce compressive forces in the deposited sputtered material.

27. The method of claim 19 further comprising selecting at least one of an energy of reactive ions in the reactive ion beam and a current density of the reactive ion beam to obtain a desired refractive index of the deposited sputtered material.

28. The method of claim 19 further comprising selecting at least one of an energy of reactive ions in the reactive ion beam and a current density of the reactive ion beam to oxidize a single monolayer of deposited sputtered material as the substrate is transported through the reactive ion beam.

29. The method of claim 19 further comprising selecting at least one of an energy of reactive ions in the reactive ion beam and a current density of the reactive ion beam to increase oxidization of the deposited sputter material.

30. The method of claim 19 further comprising adjusting a shape of an aperture positioned in a path of the sputtering flux to improve uniformity of the deposited sputtered material.

31. The method of claim 19 further comprising generating the reactive ion beam remotely from the vacuum chamber.

32. The method of claim 19 further comprising extracting the reactive ion beam through a grid so that the ions achieve a predetermined energy.

33. The method of claim 19 further comprising evacuating a volume of gas proximate to the sputter source.

34. The method of claim 19 further comprising collimating the sputtering flux to control a direction of the sputtering flux.

35. A sputtering system comprising:

a) a means for generating a reactive ion beam in a vacuum chamber from a reactant gas;

b) a means for containing an inert gas within a sputter source positioned inside the vacuum chamber so as to impede the reactant gas from entering into the sputter source;

c) a means for generating sputtering flux from the inert gas contained within the sputter source; and

d) a means for transporting a substrate through the reactive ion beam and through the sputtering flux in the sputter source, thereby reacting the reactive ions with deposited sputtered material.