Sensor module

• US 20070157699A1
• Filed: 01/09/2006
• Published: 07/12/2007
• Est. Priority Date: 01/09/2006
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Hawes, Kevin, Long, Stephen, Manlove, Gregory, Borzabadi, Hamid, Vas, Timothy
• Granted Patent: US 7,331,212 B2
• Time in Patent Office: Days
• US Class Current: 73/12.10
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01P 1/023 for acceleration measuring devices

Abstract

A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Claims

1. A sensor module comprising:

a housing;

a low temperature co-fired ceramic substrate located on the housing;

a sensor located on the low temperature co-fired ceramic substrate;

signal processing circuitry located on the low temperature co-fired ceramic substrate; and

a metal shield substantially encapsulating the sensor.

2. The sensor module as defined in claim 1, wherein the metal shield comprises a first metal can overlying the sensor on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.

3. The sensor module as defined in claim 2, wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.

4. The sensor module as defined in claim 1, wherein the signal processing circuitry comprises an ASIC.

5. The sensor module as defined in claim 1 further comprising another sensor formed on another low temperature co-fired ceramic substrate, said another sensor having another metal shield.

6. The sensor module as defined in claim 5, wherein the sensors comprise a pressure sensor and an accelerometer.

7. The sensor module as defined in claim 1, wherein the sensor comprises a pressure sensor.

8. The sensor module as defined in claim 1, wherein the sensor comprises an accelerometer.

9. The sensor module as defined in claim 1, wherein the sensor is a vehicle crash sensor.

10. A vehicle crash sensor comprising:

a housing;

a low temperature co-fired ceramic substrate located on the housing;

a sensor located on the low temperature co-fired ceramic substrate;

signal processing circuitry located on the low temperature co-fired ceramic substrate; and

a metal shield on the low temperature co-fired ceramic substrate and substantially encapsulating the sensor.

11. The sensor module as defined in claim 10, wherein the metal shield comprises a first metal can overlying the sensor on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.

12. The sensor module as defined in claim 11, wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.

13. The sensor module as defined in claim 10, wherein the signal processing circuitry comprises an ASIC.

14. The sensor module as defined in claim 10 further comprising another sensor formed on another low temperature co-fired ceramic substrate located on the housing, said another sensor having another metal shield.

15. The sensor module as defined in claim 14, wherein the sensors comprise a pressure sensor and an accelerometer.

16. The sensor module as defined in claim 10, wherein the sensor comprises a pressure sensor.

17. The sensor module as defined in claim 10, wherein the sensor comprises an accelerometer.