Solid state detector packaging technique

• US 20070158574A1
• Filed: 08/02/2005
• Published: 07/12/2007
• Est. Priority Date: 08/13/2004
• Status: Active Grant

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Ye, Jinghan, Vesel, John, Tseng, Sanyi, Cora, Sorin, Petrillo, Michael
• Granted Patent: US 7,649,178 B2
• Time in Patent Office: Days
• US Class Current: 250/370.130
• CPC Class Codes: A61B 6/037 Emission tomography
• CPC Class Codes: G01T 1/244 Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like
• CPC Class Codes: G01T 1/249 specially adapted for use in SPECT or PET SPECT imaging G01T1/1642; PET imaging G01T1/2985; detecting prohibited goods, e.g. weapons, explosives, hazardous substances, contraband or smuggled objects G01V5/20
• CPC Class Codes: G01T 1/2985 In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); using external radiation sources A61B6/02
• CPC Class Codes: H01M 10/4207 for several batteries or cells simultaneously or sequentially
• CPC Class Codes: H01M 10/425 Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing printed circuits H05K1/00
• CPC Class Codes: H01M 50/107 having curved cross-section, e.g. round or elliptic H01M50/103, H01M50/109, H01M50/11 take precedence
• CPC Class Codes: Y02E 60/10 Energy storage using batteries

Abstract

A radiation detector package includes a radiation-sensitive solid-state element (10) having a first electrode (12) and a pixelated second electrode (14) disposed on opposite principal surfaces of the solid-state element. An electronics board (20) receives an electrical signal from the solid-state element responsive to radiation incident upon the radiation-sensitive solid-state element. A light-tight shield (40, 40′) shields at least the radiation-sensitive solid-state element from light exposure and compresses an insulating elastomer and metal element connector (30, 32) between the pixilated electrode (14) and contact pads (24) on the electronics board.

Claims

1. A radiation detector package comprising:

a radiation-sensing solid-state element;

a first electrode disposed on a first principal surface of the solid-state element;

a pixelated second electrode disposed on a second principal surface of the solid-state element opposite the first principal surface;

an electronics board receiving an electrical signal from the solid-state element responsive to radiation incident upon the radiation-sensitive solid-state element; and

a light-tight shield shielding at least the radiation-sensitive solid-state element from light exposure and compressively maintaining the radiation-sensing element and the electronics based in a preselected, electrically interconnected relationship.

2. The radiation detector package as set forth in claim 1, further including:

at least one electrically conductive membrane disposed between the pixelated second electrode and the electronics board, the electrically conductive membrane providing electrical connection between pixels of the pixelated second electrode and corresponding electrical pads of the electronics board.

3. The radiation detector package as set forth in claim 2, further including:

a thermally conductive plate in thermal communication with elements of the electronics board, the light-tight shield and the thermally conductive plate being connected together, the radiation-sensitive solid-state element, electronics board, and electrically conductive membrane being compressively held between the connected thermally conductive plate and light-tight shield.

4. The radiation detector package as set forth in claim 3, wherein the connection between the light-tight shield and the thermally conductive plate hermetically seals the radiation-sensitive solid-state element, electronics board, and electrically conductive elastic membrane inside of a housing defined by the light-tight shield and thermally conductive plate and further including a dry atmosphere inside the housing.

5. The radiation detector package as set forth in claim 2, wherein the light-tight shield and the electronics board are connected together, the radiation-sensitive solid-state element and the electrically conductive elastic membrane being compressively held between the connected light-tight shield and electronics board.

6. The radiation detector package as set forth in claim 2, wherein the light-tight shield includes:

a front principal side disposed over the radiation-sensitive solid-state element; and

a plurality of sidewalls extending from edges of the front principal side across sidewalls of the solid-state element and electronics board, the sidewalls connecting with one of (i) the electronics board and (ii) a thermally conductive plate disposed on a side of the electronics board distal from the radiation-sensitive solid-state element.

7. The radiation detector package as set forth in claim 6, further including:

an insulating layer disposed between the light-tight shield and the first electrode.

8. The radiation detector package as set forth in claim 2, wherein the electrically conductive membrane includes:

an electrically insulating elastic membrane with spaced, flexible, electrically conductive elements dispersed therein, the electrically conductive elements being oriented generally transverse to the plane of the electrically insulating elastic membrane.

9. The radiation detector package as set forth in claim 8, wherein the electrically conductive elements are fibers.

10. The radiation detector package as set forth in claim 2, wherein the electronics board includes:

a printed circuit board, the electrical pads of the electronics board being disposed on a first principal side of the printed circuit board; and

one or more integrated circuit components disposed on a second principal side of the electronics board opposite the first principal side of the printed circuit board, the one or more integrated circuit components being electrically connected with the electrical pads on the first principal side by printed circuitry of the printed circuit board.

11. The radiation detector package as set forth in claim 10, wherein the electronics board further includes:

one or more electrical connectors disposed on the second principal side of the printed circuit board such that the radiation detector package has a radiation-sensitive first principal package side, a second principal package side opposite the first principal package side with the one or more electrical connectors, and a plurality of package sidewalls extending between the first and second principal sides, the sidewalls being buttable with sidewalls of other radiation detector packages to enable tiling of a plurality of radiation detector packages as a radiation detector array.

12. The radiation detector package as set forth in claim 10, further includes:

a thermally conductive plate abutting the integrated circuit components, the light-tight shield being deformed around the thermally conductive plate compressively gripping the electrically conductive membrane between the pixilated second electrode and the pads.

13. The radiation detector package as set forth in claim 1, wherein the radiation-sensitive solid-state element is a CZT crystal.

14. A medical imager comprising:

a gantry defining an imaging region; and

an array of radiation detector packages, wherein at least one of the radiation detector packages comprises;

a radiation-sensing solid-state element;

a first electrode disposed on a first principal surface of the solid-state element;

a pixelated second electrode disposed on a second principal surface of the solid-state element opposite the first principal surface;

an electronics board receiving an electrical signal from the solid-state element responsive to radiation incident upon the radiation-sensitive solid-state element; and

a light-tight shield shielding at least the radiation-sensitive solid-state element from light exposure and compressively maintaining the radiation-sensing element and the electronics based in a preselected, electrically interconnected relationship.

15. The medical imager as set forth in claim 14, wherein the medical imager is selected from a group consisting of:

(i) a single-photon emission computed tomography (SPECT) imager, (ii) a positron emission tomography (PET) imager, and (iii) a transmission computed tomography imager.

16. A method of making a radiation detector package comprising:

stacking (i) a radiation-sensing solid-state element with a first electrode on a first principal surface and a second pixilated electrode on a second, opposite principle surface, (ii) an electronics board with an array of electrical contact pads facing the pixilated electrode, and (iii) an electrically conductive membrane between the pixilated electrode and the electrical contact pads;

compressing the electrically conductive membrane into electrical and mechanical contact with the pixilated electrode and the electrical contact pads with a light-tight shield that shields the radiation receiving element from light.

17. The method according to claim 16, further including:

stacking a cold plate on an opposite side of the electronics board from the radiation-sensing element and wherein the compressing step includes;

bending the light-tight shield around the cold plate.

18. The method according to claim 17, wherein the light-tight shield is hermetically sealed to the cold plate and further including:

before the compressing step, filling the package with dry gas.

19. A radiation detector package made according to the method of claim 16.

20. A method of medical imaging comprising:

sensing radiation exiting a patient with the detector package of claim 19;

reconstructing a medical diagnostic image from the sensed radiation.

21. An imaging detector comprising:

a radiation-sensing solid-state element;

a first electrode disposed on a first surface of the solid-state element;

a pixilated second electrode disposed on a second surface of the solid-state element;

an electronics board receiving an electrical signal from the solid-state element responsive to radiation incident upon the solid state element; and

at least one electrically conductive membrane disposed between the pixilated second electronics board and the electronics board, the electronically conductive membrane providing electrical connection between the pixels of the pixilated second electrode and selected portions of the electronics board.

22. The imaging detector of claim 21 wherein the electrically conductive membrane is compressively held between pixilated second electrode and the electronics board.

23. The imaging detector of claim 21 further comprising a housing shielding at least a portion of the solid-state element from light exposure.

24. The imaging detector of claim 23 wherein the housing provides compressive force that acts upon the electrically conductive membrane.