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Chip coated light emitting diode package and manufacturing method thereof

  • US 20070158669A1
  • Filed: 01/10/2007
  • Published: 07/12/2007
  • Est. Priority Date: 01/10/2006
  • Status: Active Grant
First Claim
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1. A chip coated Light Emitting Diode (LED) package comprising:

  • a light emitting chip including a chip die attached to a submount and a resin layer covering an outer surface of the chip die;

    at least one bump ball provide d on the chip die and exposed through an upper surface of the resin layer and an electrode part electrically connected to the at least one bump ball by a metal wire; and

    a package body having the electrode part and the light emitting chip mounted thereon.

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