Chip coated light emitting diode package and manufacturing method thereof
First Claim
1. A chip coated Light Emitting Diode (LED) package comprising:
- a light emitting chip including a chip die attached to a submount and a resin layer covering an outer surface of the chip die;
at least one bump ball provide d on the chip die and exposed through an upper surface of the resin layer and an electrode part electrically connected to the at least one bump ball by a metal wire; and
a package body having the electrode part and the light emitting chip mounted thereon.
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Accused Products
Abstract
A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
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Citations
14 Claims
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1. A chip coated Light Emitting Diode (LED) package comprising:
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a light emitting chip including a chip die attached to a submount and a resin layer covering an outer surface of the chip die;
at least one bump ball provide d on the chip die and exposed through an upper surface of the resin layer and an electrode part electrically connected to the at least one bump ball by a metal wire; and
a package body having the electrode part and the light emitting chip mounted thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a chip coated Light Emitting Diode (LED) package comprising:
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die-attaching a plurality of chip dies on a wafer;
providing at least one bump ball on an upper surface of each of the chip dies;
forming a resin layer to cover the chip dies including the bump balls;
polishing an upper surface of the resin layer to expose the bump balls; and
cutting the wafer and the resin layer between the chip dies into individual light emitting chips. - View Dependent Claims (11, 12, 13, 14)
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Specification