SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a substrate;
a semiconductor chip having a diaphragm, which vibrates in response to pressure variations; and
a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is positioned opposite to and fixed to a surface of the circuit chip whose backside is attached onto a surface of the substrate.
1 Assignment
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Accused Products
Abstract
A semiconductor device includes a substrate, a semiconductor chip having a diaphragm, which vibrates in response to sound pressure variations, and a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is fixed to the surface of the circuit chip whose backside is mounted on the surface of the substrate. Herein, a plurality of connection terminals formed on the backside of the semiconductor chip are electrically connected to a plurality of electrodes running through the circuit chip. A ring-shaped resin sheet is inserted between the semiconductor chip and the circuit chip. The semiconductor chip and the circuit chip vertically joined together are stored in a shield case having a mount member (e.g., a stage) and a cover member, wherein connection terminals of the circuit chip are exposed to the exterior via through holes of the stage.
66 Citations
29 Claims
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1. A semiconductor device comprising:
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a substrate;
a semiconductor chip having a diaphragm, which vibrates in response to pressure variations; and
a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is positioned opposite to and fixed to a surface of the circuit chip whose backside is attached onto a surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A manufacturing method for a semiconductor device, in which a semiconductor chip having a diaphragm and a circuit chip are vertically joined together and are stored in a shield case such that the diaphragm is exposed to an exterior of the shield case, said manufacturing method comprising the steps of:
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attaching the semiconductor chip onto a surface of the circuit chip in such a way that the diaphragm is positioned opposite to the circuit chip, thus fixing and electrically connecting together the semiconductor chip and the circuit chip;
fixing the circuit chip onto a surface of a stage having a rectangular shape included in a mount member of the shield case, in which an insulating film is coated on a surface of a conductive member, thus exposing a plurality of connection terminals, which are formed on a backside of the circuit chip, to an exterior of the mount member via a plurality of through holes, which are formed in the stage; and
covering the semiconductor chip and the circuit chip, which are vertically joined together, with a cover member of the shield case, in which an insulating film is coated on a surface of a conductive member, so that the cover member is engaged with the mount member so as to form the shield case, wherein prescribed portions of the conductive member of the cover member are tightly engaged with prescribed portions of the conductive member of the mount member so as to remove the insulating films therefrom, so that the conductive member of the cover member is brought into direct contact with the conductive member of the mount member. - View Dependent Claims (28, 29)
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Specification