Media-exposed interconnects for transducers

• US 20070160748A1
• Filed: 12/30/2005
• Published: 07/12/2007
• Est. Priority Date: 12/30/2005
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Mattes, Michael, Ruben, David, Larson, Lary, Schugt, Michael, Mothilal, Kamal
• Granted Patent: US 9,616,223 B2
• Time in Patent Office: Days
• US Class Current: 427/117
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81C 2201/0167 by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: Y02A 90/10 Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation

Abstract

Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

Claims

1. A lead for electrically communicating with an implantable medical device comprising:

a lead body supporting a conductor, the conductor adapted for electrical communication with the implantable medical device;

transducer module including a transducer supported by the lead body and including an electrically conductive interface pad, the transducer being configured to provide an electrical signal to the interface pad; and

a media-exposed interconnect generally exposed when in an implant environment, the interconnect including at least one conductive layer deposited over the interface pad and being coupled to the conductor to provide a conductive interface between the transducer and the conductor.

2. The lead of claim 1, wherein the media-exposed interconnect is configured to maintain long-term electrical communication between the transducer and the conductor when the transducer is subject to a DC bias.

3. The lead of claim 1, wherein the at least one layer is selected from the group consisting of titanium, niobium, tantalum, vanadium, hafnium, zirconium, and alloys thereof.

4. The lead of claim 1, wherein the at least one layer comprises an interlayer selected from the group consisting of polymer, silicon, and combinations thereof.

5. The lead of claim 1, wherein the pad comprises a machined stud.

6. The lead of claim 1, wherein the transducer comprises an integrated circuit and the interconnect is configured to allow electrical communication between the integrated circuit and the conductor when in the implant environment.

7. The lead of claim 1, wherein the transducer comprises a MEMS.

8. A transducer module for an implantable medical device comprising:

a capsule in electrical communication with the implantable medical device;

a conductor in electrical communication with the capsule;

a transducer disposed at least partially within the capsule and including an electrically conductive interface pad, the transducer being configured to provide an electrical signal to the interface pad; and

a media-exposed interconnect generally exposed when in an implant environment, the interconnect including at least one conductive layer deposited over the interface pad and being coupled to the conductor to provide a conductive interface between the transducer and the conductor.

9. The transducer module of claim 8, wherein the media-exposed interconnect includes a configuration that maintains long-term electrical communication between the transducer and the conductor when the transducer is subject to a DC bias.

10. The transducer module of claim 8, wherein the at least one layer is selected from the group consisting of titanium, niobium, tantalum, vanadium, hafnium, zirconium, and alloys thereof.

11. The transducer module of claim 8, wherein the at least one layer comprises an interlayer selected from the group consisting of polymer, silicon, and combinations thereof.

12. The transducer module of claim 8, wherein the pad comprises a machined stud.

13. The transducer module of claim 8, wherein the transducer comprises an integrated circuit and the interconnect is configured to allow electrical communication between the integrated circuit and the conductor when in the implant environment.

14. The transducer module of claim 8, wherein the transducer comprises a MEMS.

15. The transducer module of claim 8, wherein the media-exposed interconnect comprises means for reducing stress existing between the pad and the transducer.

16. A method for creating a robust, media-exposed interconnect to connect a transducer with an implantable medical device, the method comprising:

providing a transducer including an electrically-conductive interface pad configured to provide an electrical communication interface for the transducer;

depositing a first layer over the pad, the first layer selected from the group consisting of titanium, niobium, tantalum, vanadium, hafnium, zirconium, and alloys thereof, and

attaching a conductor to the pad, the conductor being configured to communicate electrically with the implantable medical device.

17. The method of claim 16, further comprising depositing a second layer between the first layer and the pad.

18. The method of claim 17, wherein the second layer is selected from the group consisting of titanium, niobium, tantalum, vanadium, hafnium, zirconium, and alloys thereof.

19. The method of claim 17, wherein the second layer selected from the group consisting of polymer, silicon, and combinations thereof, and the method further comprises providing electrical communication between the pad and the first layer by way of a via.

20. The method of claim 17, wherein depositing the first and second layers is configured to relieve stress existing between the pad and the transducer.