PROCESS FOR FORMING A PATTERNED THIN FILM STRUCTURE FOR IN-MOLD DECORATION

• US 20070160762A1
• Filed: 12/18/2006
• Published: 07/12/2007
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated), ETANSI, Inc.
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated), ETANSI, Inc.
• Inventors: Liang, Rong-Chang, Chaug, Yi-Shung, Wang, Xiaojia, Zang, HongMei, Kiluk, Sean, Tseng, Scott
• Granted Patent: US 7,972,472 B2
• Time in Patent Office: Days
• US Class Current: 427/256
• CPC Class Codes: B29C 2045/14704 ink decorations
• CPC Class Codes: B29C 45/14688 Coating articles provided with a decoration
• CPC Class Codes: B29K 2705/00 Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• CPC Class Codes: B44C 1/1729 Hot stamping techniques
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face

Abstract

A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Claims

1. A process for forming a patterned thin film structure on a substrate, comprising:

printing a pattern on the substrate using a strippable material comprising-5-80% by weight of a re-dispersible particulate, the printed strippable material defining a negative image of a decorative design to be formed on the substrate, such that the printed strippable material is present in areas on the substrate where the thin film structure is not to be formed and the printed strippable material is substantially not present in the area on the substrate where the thin film structure is to be formed;

depositing a thin film material on the patterned substrate; and

stripping the strippable material from the substrate;

whereby the strippable material and any thin film material formed thereon are removed by said stripping leaving behind the thin film structure formed on the substrate in the shape of said decorative design;

wherein the substrate and the patterned thin film structure formed thereon are suitable for use as an IMD decorated film.

2. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises 10-60% by weight of said re-dispersible particulate.

3. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises a water soluble or water dispersible polymer as a binder.

4. The process for forming a patterned thin film structure on a substrate as recited in claim 3, wherein said water soluble or water dispersible polymer is selected from the group consisting of polyvinyl alcohol, polyvinylpyrrolidone, polyvinyl pyridine, polyacrylic acid, polymethacrylic acid, polyacrylamide, polyethylene glycol, poly(ethylene-co-maleic anhydride), poly (vinyl ether-co-maleic anhydride), poly(styrene-co-maleic anhydride), poly(butyelene-co-itaconic acid), PEOX, polystyrene sulfonate, cellulose derivatives, xanthan gum, gum Arabic, gelatin, lecitin, and copolymers thereof.

5. The process for forming a patterned thin film structure on a substrate as recited in claim 3, wherein said water soluble or water dispersible polymer comprises a water dispersible polymer selected from the group consisting of water- or alkaline-dispersible waxes, polyolefin, and acrylic latexes or dispersions.

6. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material comprises a solvent soluble or solvent dispersible polymer as a binder.

7. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the re-dispersible particulate is derived from silica, CaCO₃, CaSO₄, BaSO₄, Al₂O₃, TiO₂, hollow-spheres, non-film-forming latexes or dispersions, inorganic pigment, or organic pigment.

8. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the re-dispersible particulate is a polymeric particle or a polymeric composite particle.

9. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the strippable material further comprises an additive selected from the group consisting of surfactants, dyes, curing agents, and plasticizers;

whereby the presence of said additive facilitates the stripping of the strippable material subsequent to the deposition of the thin film material.

10. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is non-conductive.

11. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is semi-conductive.

12. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the thin film material is conductive.

13. The process for forming a patterned thin film structure on a substrate as recited in claim 12, wherein the conductive thin film material is a material selected from the group consisting of metals, metal oxides, and alloys or multilayer composites thereof.

14. The process for forming a patterned thin film structure on a substrate as recited in claim 12, wherein the conductive thin film material is a metal selected from the group consisting of aluminum, copper, zinc, tin, molybdenum, nickel, chromium, silver, gold, iron, indium, thallium, titanium, tantalum, tungsten, rhodium, palladium, platinum and cobalt.

15. The process for forming a patterned thin film structure on a substrate as recited in claim 12, wherein the conductive thin film material is a metal oxide or sulfide selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide, gadolinium indium oxide, tin oxide, fluorine-doped indium oxide and zinc sulfide.

16. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of depositing the thin film material comprises sputtering, vapor deposition, vacuum deposition, electroplating, electro-less plating or electroforming.

17. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of printing comprises flexographic printing, driographic printing, electro photographic printing, lithographic printing, gravure printing, thermal printing, inkjet printing, screen printing or stamp printing.

18. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a plastic substrate.

19. The process for forming a patterned thin film structure on a substrate as recited in claim 18, wherein the plastic substrate comprises a portion of a roll of plastic substrate.

20. The process for forming a patterned thin film structure on a substrate as recited in claim 19, wherein the process for forming a patterned thin film structure on the substrate is a component part of a roll-to-roll process for fabricating the IMD decorated film.

21. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a polyethylene terephthalate (PET) film.

22. The process for forming a patterned thin film structure on a substrate as recited in claim 21, further comprising performing the following steps prior to forming the patterned thin film structure on the substrate:

treating or coating the PET film with a release agent or coating; and

coating the treated or coated PET film with a durable layer to provide oil and scratch resistance.

23. The process for forming a patterned thin film structure on a substrate as recited in claim 21, further comprising printing on the substrate a second decorative design using a printable material other than the thin film material.

24. The process for forming a patterned thin film structure on a substrate as recited in claim 21, further comprising coating the IMD decorated film with an adhesive to form an in-mold transfer film.

25. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the substrate comprises a polycarbonate (PC) substrate.

26. The process for forming a patterned thin film structure on a substrate as recited in claim 25, further comprising coating the IMD decorated film with a thin protective layer.

27. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises using a solvent to remove the strippable material.

28. The process for forming a patterned thin film structure on a substrate as recited in claim 27, wherein the solvent is selected from the group consisting of water, aqueous solutions, alcohols, ketones, esters, ethers, amides, hydrocarbons, alkyl benzenes, pyrrolidones, sulfones, DMSO, and mixtures or derivatives thereof.

29. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises using mechanical pressure to remove the strippable material.

30. The process for forming a patterned thin film structure on a substrate as recited in claim 29, wherein using mechanical pressure comprises brushing or using a spray nozzle.

31. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises:

applying an adhesive layer having a higher adhesive strength with respect to the thin film material and/or strippable material than the adhesive strength of the strippable material to the substrate; and

removing the strippable material and any thin film material deposited thereon by peeling off the adhesive layer.

32. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the step of stripping comprises:

applying an adhesive layer to the substrate after the depositing step; and

removing the thin film material with the strippable material by peeling off the adhesive layer.

33. The process for forming a patterned thin film structure on a substrate as recited in claim 32, wherein the cohesion strength of the thin film material and the adhesion strength between thin film material and the substrate are stronger than any of the three forces:

the cohesion strength of the strippable material, the adhesion strength between the thin film material and the strippable material, and the adhesion strength between the strippable material and the substrate.

34. A process for forming patterned thin film structures on a substrate, comprising:

printing a first pattern on a first surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the first pattern of the strippable material defining a negative image of a first thin film structure to be formed on the first surface of the substrate;

depositing a thin film material on the patterned first surface of the substrate;

stripping the first pattern of the strippable material from the substrate;

printing a second pattern on a second surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the second pattern of the strippable material defining a negative image of a second thin film structure to be formed on the second surface of the substrate;

depositing a thin film material on the patterned second surface of the substrate; and

stripping the second pattern of the strippable material from the substrate;

whereby the first pattern of the strippable material, the second pattern of the strippable material, and any thin film material formed on either the first or the second pattern of the strippable material are removed leaving behind the first thin film structure on the first surface of the substrate and the second thin film structure on the second surface of the substrate;

wherein the first thin film structure comprises a first decorative design, the second thin film structure comprises a second decorative design, and the substrate and the patterned thin film structures formed thereon are suitable for use as an IMD decorated film.

35. A process for forming patterned thin film structures on a substrate, comprising:

printing a first pattern on a first surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the first pattern of the strippable material defining a negative image of a first thin film structure to be formed on the first surface of the substrate;

printing a second pattern on a second surface of the substrate using a strippable material comprising 10-60% by weight of a re-dispersible particulate, the second pattern of the strippable material defining a negative image of a second thin film structure to be formed on the second surface of the substrate;

depositing a thin film material on the patterned first surface and on the patterned second surface of the substrate; and

stripping the first pattern and second pattern of the strippable material from the substrate;

whereby the first pattern of the strippable material, the second pattern of the strippable material, and any thin film material formed on either the first or the second pattern of the strippable material are removed leaving behind the first thin film structure on the first surface of the substrate and the second thin film structure on the second surface of the substrate; and

wherein the first thin film structure comprises a first decorative design, the second thin film structure comprises a second decorative design, and the substrate and the patterned thin film structures formed thereon are suitable for use as an IMD decorated film.

36. A process for forming a patterned thin film structure on a substrate, comprising:

printing a pattern on the substrate using a printable material, the printed printable material defining a positive image of a decorative design to be formed on the substrate, such that the printable material is printed in areas where the thin film structure is to be formed;

depositing a thin film material on the patterned substrate, wherein the thin film material, the printable material, and the substrate are chosen so that the thin film material adheres more strongly to the printable material than to the substrate; and

stripping the thin film material formed directly on the substrate using a stripping process that does not strip the thin film material from the printable material such that the thin film material remains on the printable material used to define the pattern in which the thin film structure is to be formed;

wherein the substrate and the patterned thin film structure formed thereon are suitable for use as an IMD decorated film.

37. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the printable material comprises a primer coating, adhesive, tie coat, or adhesion promoting material.

38. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the printable material comprises ink.

39. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the printable material is radiation curable or thermal curable.

40. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the stripping process comprises using a solvent.

41. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the stripping process comprises using mechanical pressure.

42. The process for forming a patterned thin film structure on a substrate as recited in claim 41, wherein using mechanical pressure comprises brushing or using a spray nozzle.

43. The process for forming a patterned thin film structure on a substrate as recited in claim 36, wherein the printable material comprises a first adhesive, adhesion promoting or tie material and the stripping process comprises:

applying a second adhesive layer to the substrate after the thin film deposition step; and

removing the thin film material without removing the first adhesive, adhesion promoting or tie material by peeling off the second adhesive layer.

44. The process for forming a patterned thin film structure on a substrate as recited in claim 43, wherein the adhesion strength between thin film material and the substrate is the weakest as compared to the cohesion strength of the second adhesive layer, the cohesion strength of the first adhesive, adhesion promoting or tie material, the cohesion strength of the thin film material, the adhesion strength between the thin film material and the second adhesive layer, and the adhesion between the thin film material and the first adhesive, adhesion promoting or tie material.