Process monitoring device for sample processing apparatus and control method of sample processing apparatus

• US 20070162172A1
• Filed: 12/27/2006
• Published: 07/12/2007
• Est. Priority Date: 03/05/2001
• Status: Active Grant

• Current Assignee: Hideyuki Yamamoto, Hiroyuki Kitsunai, Junichi Tanaka, Kazue Takahashi, Shoji Ikuhara
• Original Assignee: Hideyuki Yamamoto, Hiroyuki Kitsunai, Junichi Tanaka, Kazue Takahashi, Shoji Ikuhara
• Inventors: Tanaka, Junichi, Ikuhara, Shoji, Yamamoto, Hideyuki, Takahashi, Kazue, Kitsunai, Hiroyuki
• Granted Patent: US 7,376,479 B2
• Time in Patent Office: Days
• US Class Current: 700/108
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 21/02 electric
• CPC Class Codes: G05B 2219/32053 Adjust work parameter as function of other cell
• CPC Class Codes: G05B 2219/32182 If state of tool, product deviates from standard, adjust system, feedback
• CPC Class Codes: G05B 23/0221 Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A plasma processing method for processing a sample by using plasma on a lot unit basis, including: detecting plural kinds of information as monitor data relating to a processing state of the sample, using a plurality of sensors; selecting a detection time range of the monitor data thus detected; converting the monitor data within the selected detection time range into a converted signal; predicting a pattern shape of the sample based on the converted signal; calculating a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value; and converting the correction quantity of a processing parameter obtained by the calculating operation when a kind of a next sample of a next lot is different from the sample, thereby to use a converted correction quantity of the processing parameter for a processing of the next sample.

Claims

1. A plasma processing method for processing a sample by using plasma on a lot unit basis, comprising:

detecting plural kinds of information as monitor data relating to a processing state of the sample, using a plurality of sensors;

selecting a detection time range of the monitor data thus detected, which is used for monitoring a plasma processing;

converting the monitor data within the selected detection time range into a converted signal;

predicting a pattern shape of the sample based on the converted signal;

calculating a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value;

storing the correction quantity of the processing parameter; and

converting the correction quantity of a processing parameter obtained by the calculating operation when a kind of a next sample of a next lot is different from the sample, thereby to use a converted correction quantity of the processing parameter for a processing of the next sample.

2. A plasma processing method for processing a sample by using plasma on a lot unit basis, comprising:

detecting plural kinds of information as monitor data relating to a processing state of the sample, using a plurality of sensors;

selecting a detection time range of the monitor data thus detected, which is used for monitoring a plasma processing;

converting the monitor data within the selected detection time range, into a converted signal;

predicting a pattern shape of the sample based on the converted signal;

calculating a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value; and

storing the correction quantity of the processing parameter,

wherein a correction quantity of a processing parameter obtained by the calculating operation at a time of processing a sample at a position of one lot is used for a processing of a sample at the same position of a next lot.