Mechanical decoupling device for monlithic differential vibrating sensor

• US 20070163347A1
• Filed: 04/21/2005
• Published: 07/19/2007
• Est. Priority Date: 05/05/2004
• Status: Active Grant

• Current Assignee: Office National D'Etudes et de Recherches Aerospatiales
• Original Assignee: Office National D'Etudes et de Recherches Aerospatiales
• Inventors: Pernice, Marc, Le Traon, Olivier, Janiaud, Denis, Muller, Serge, Lecorre, Bernard
• Granted Patent: US 7,448,268 B2
• Time in Patent Office: Days
• US Class Current: 73/514.290
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: H03H 9/505 for microelectro-mechanical filters

Abstract

A sensor comprises two identical vibrating members operating with a common working frequency and joined to each other by a mechanical decoupling device. The device comprises a frame and two connecting bridges each supporting one member. The frame comprises a succession of mass portions and thinned portions so that the frequency of one mode of structural resonance of the frame is substantially equal to the common working frequency, and each connecting bridge is disposed in a node of vibration of the frame at the common working frequency. Thus, the vibrations of the two vibrating members are decoupled from each other.

Claims

1. A sensor machined in a plane plate including two substantially identical vibrating members operating in differential mode with a common working frequency and joined to each other by a mechanical device, symmetrical about an axis perpendicular to said plate, said mechanical device comprising a frame and two connecting bridges respectively supporting said vibrating members, said frame comprising a succession of mass portions and thinned portions and being dimensioned by means of a theoretical model of vibratory behavior of said frame so that the frequency of one mode of structural resonance of said frame is substantially equal to said common working frequency, each connecting bridge being disposed in a node of vibration of said frame at said common working frequency, and said mechanical device having no plane of symmetry passing through said perpendicular axis.

2. A sensor according to claim 1, wherein two of said thinned portions are on respective opposite sides of each of the two connecting bridges and closest to said each connecting bridge and have very different mechanical flexibilities from each other.

3. A sensor according to claim 1, wherein said frame surrounds said two vibrating members.

4. A sensor according to claim 1, wherein the frame comprises first sides and second sides disposed as a rectangular general shape, said first sides being disposed facing each other and fastened respectively to said connecting bridges, and each of said first sides having two thinned portions on opposite sides of the respective connecting bridges.

5. A sensor according to claim 4, wherein said thinned portions of said first sides fastened respectively to said connecting bridges have a section dimension in the plane of the frame lying between one quarter and one half of the section dimension of non-thinned portions of said two sides.

6. A sensor according to claim 5, wherein two of said thinned portions are on respective opposite sides of each of the two connecting bridges and closest to said each connecting bridge and have length dimensions very different therebetween, the greatest of said length dimensions lying between twice times and ten times the other length dimension.

7. A sensor according to claim 6, wherein said second sides each have a thinned portion having a section dimension in the plane of the frame lying between one quarter and one half of the section dimension of non-thinned portions of said second sides.

8. A sensor according to claim 7, wherein the length dimension of the thinned portions of said second sides lies between one half and twice of the length dimension of the longest of the two thinned portions on respective opposite sides of each of said two connecting bridges and closest to said each connecting bridge.