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INTEGRATED MEMS PACKAGE

  • US 20070164378A1
  • Filed: 01/13/2006
  • Published: 07/19/2007
  • Est. Priority Date: 01/13/2006
  • Status: Abandoned Application
First Claim
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1. A substrate as a component of an integrated MEMS package, the substrate comprising:

  • a substantially planar first surface, the first surface defining a cavity configured to receive a MEMS die;

    a substantially planar second surface parallel to and spaced apart from the first surface, the second surface configured to receive a flip chip; and

    a plurality of conductive traces configured to conduct electrons, in the presence of the MEMS die and flip chip, from the MEMS die to the flip chip in operative connection.

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