METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
First Claim
1. A circuit component, comprising:
- a semiconductor substrate;
a dielectric layer having a dielectric constant of less than 3.0 over said semiconductor substrate;
a first metal pad over said dielectric layer;
a passivation layer over said dielectric layer, an opening in said passivation layer exposing said first metal pad;
a second metal pad over said dielectric layer, wherein said second metal pad is connected to said first metal pad through said opening, and wherein said second metal pad comprises a first copper layer; and
a wire bonded to said second metal pad.
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Accused Products
Abstract
A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metallization formed over the active and/or passive devices. A passivation layer formed over the interconnect metallization is provided, wherein openings are formed in the passivation layer to an upper metal layer of the interconnect metallization. Compliant metal bond pads are formed over the passivation layer, wherein the compliant metal bond pads are connected through the openings to the upper metal layer, and wherein the compliant metal bond pads are formed substantially over the active and/or passive devices. The compliant metal bond pads may be formed of a composite metal structure.
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Citations
21 Claims
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1. A circuit component, comprising:
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a semiconductor substrate;
a dielectric layer having a dielectric constant of less than 3.0 over said semiconductor substrate;
a first metal pad over said dielectric layer;
a passivation layer over said dielectric layer, an opening in said passivation layer exposing said first metal pad;
a second metal pad over said dielectric layer, wherein said second metal pad is connected to said first metal pad through said opening, and wherein said second metal pad comprises a first copper layer; and
a wire bonded to said second metal pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A circuit component, comprising:
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a semiconductor substrate;
a dielectric layer having a dielectric constant of less than 3.0 over said semiconductor substrate;
a passivation layer over said dielectric layer;
a metal pad over said passivation layer, wherein said metal pad comprises a first copper layer; and
a wire bonded to said metal pad. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification