SEMICONDUCTOR DEVICE AND ELECTRIC APPARATUS

• US 20070164788A1
• Filed: 12/21/2006
• Published: 07/19/2007
• Est. Priority Date: 12/22/2005
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Mizuta, Masaru, HIURA, Shigeru, Shibata, Kiyoyasu, Kitahara, Takaya, Takiba, Akira, Kinugasa, Masanori
• Granted Patent: US 7,473,991 B2
• Time in Patent Office: Days
• US Class Current: 326/62
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H03F 2200/114 the amplifier comprising means for electro-magnetic interference [EMI] protection
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communication path. The output section outputs a data signal into the data communication path, and has a buffer amplifier section for compensating the data signal.

Claims

1. A semiconductor device comprising:

a package substrate; and

a semiconductor chip mounted on the package substrate, the semiconductor chip comprising;

an output section which outputs a data signal into a data communication path and has a buffer amplifier section which compensates the data signal; and

a filter section which decreases an electromagnetic noise generated from the data communication path.

2. The semiconductor device according to claim 1, wherein a terminal to be connected to ground in the buffer amplifier section is electrically short-circuited to a terminal to be connected to ground in the filter section by a straight wiring line formed on the package substrate.

3. The semiconductor device according to claim 1,

wherein a terminal to be connected to ground in the buffer amplifier section is electrically short-circuited to a terminal to be connected to ground in the filter section by a wiring pattern of a thin-film wiring layer formed on a main surface of the semiconductor chip.

4. The semiconductor device according to claim 3, wherein the wiring pattern is formed such that a virtual straight line is included, the virtual straight line connecting the terminal to be connected to ground in the buffer amplifier section and the terminal to be connected to ground in the filter section.

5. The semiconductor device according to claim 1, wherein a capacitor element is electrically connected a wiring line and ground, the wiring line connecting the buffer amplifier section to a power supply.

6. The semiconductor device according to claim 2, wherein a capacitor element is electrically connected a wiring line and ground, the wiring line connecting the buffer amplifier section to a power supply.

7. The semiconductor device according to claim 3, wherein a capacitor element is electrically connected a wiring line and ground, the wiring line connecting the buffer amplifier section to a power supply.

8. The semiconductor device according to claim 4, wherein a capacitor element is electrically connected a wiring line and ground, the wiring line connecting the buffer amplifier section to a power supply.

9. An electric apparatus comprising:

the semiconductor device according to claim 1;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

10. An electric apparatus comprising:

the semiconductor device according to claim 2;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

11. An electric apparatus comprising:

the semiconductor device according to claim 3;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

12. An electric apparatus comprising:

the semiconductor device according to claim 4;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

13. An electric apparatus comprising:

the semiconductor device according to claim 5;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

14. An electric apparatus comprising:

the semiconductor device according to claim 6;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

15. An electric apparatus comprising:

the semiconductor device according to claim 7;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.

16. An electric apparatus comprising:

the semiconductor device according to claim 8;

and

a communication device, the communication device exchanging data with a memory device provided in a detachable manner via the semiconductor device.