EMBEDDED ASSEMBLY INCLUDING MOVEABLE ELEMENT AND ANTENNA ELEMENT

• US 20070164905A1
• Filed: 01/18/2006
• Published: 07/19/2007
• Est. Priority Date: 01/18/2006
• Status: Active Grant

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Lempkowski, Robert, Eliacin, Manes, Lian, Keryn
• Granted Patent: US 7,508,352 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.

Claims

1. An embedded assembly comprising:

an organic substrate;

at least one movable element embedded on the organic substrate; and

at least one antenna element embedded on the organic substrate.

2. The embedded assembly as recited in claim 1 further comprising a plurality of metal layers, wherein the plurality of metal layers are present on both sides of the organic substrate.

3. The embedded assembly as recited in claim 2 further comprising one or more dielectric layers, wherein adjacent metal layers of the plurality of metal layers are separated by a dielectric layer of the one or more dielectric layers using an adhesion promoting treatment layer.

4. The embedded assembly as recited in claim 2 further comprising one or more resin layers, wherein adjacent metal layers of the plurality of metal layers are laminated by a resin layer of the one or more resin layers.

5. The embedded assembly as recited in claim 2, wherein the at least one movable element is fabricated from the same material and at the same time as at least one of the plurality of metal layers.

6. The embedded assembly as recited in claim 2, wherein the at least one antenna element is fabricated from the same material and at the same time as at least one of the plurality of metal layers.

7. The embedded assembly as recited in claim 2, wherein the at least one movable element is secured as a separate package to an exposed metal layer of the plurality of metal layers.

8. The embedded assembly as recited in claim 2 further comprising at least one passive device, wherein the at least one passive device is at least one of:

a switch, a variable/tuner capacitor, a polymer thick film resistor, an inductor, and a MEMS resonator.

9. The embedded assembly as recited in claim 2 further comprising one or more microvias and plated through holes.

10. The embedded assembly as recited in claim 2 further comprising:

one or more metal contact pads, wherein the one or more metal contact pads perform at least one of;

providing radio frequency (RF) signal path to the at least one movable element and blocking radio frequency (RF) path to the at least one movable element; and

one or more sacrificial layers, wherein the one or more sacrificial layers support the one or more metal contact pads, further wherein the one or more sacrificial layers are formed on a selected portion of at least one metal layer of the plurality of metal layers.

11. The embedded assembly as recited in claim 2 further comprising one or more antenna metallization patterns, wherein the at least one antenna element is secured to the corresponding one or more antenna metallization patterns.

12. The embedded assembly as recited in claim 2, wherein the at least one movable element and the at least one antenna element are connected to each other by at least one of the plurality of metal layers.

13. A method for fabricating an embedded assembly, the method comprising:

providing an organic substrate;

embedding at least one movable element on the organic substrate; and

embedding at least one antenna element on the organic substrate.

14. The method as recited in claim 13, wherein embedding the at least one movable element comprises:

providing a first metal layer wherein the first metal layer is one of a plurality of metal layers, wherein the plurality of metal layers are present on both sides of the organic substrate;

providing an adhesion promoting treatment layer on the plurality of metal layers;

applying a dielectric layer on the adhesion promoting treatment layer, wherein the dielectric layer is coated over the adhesion promoting treatment layer; and

laminating a second metal layer over the dielectric layer, wherein the second metal layer is a metal layer of the plurality of metal layers.

15. The method as recited in claim 14 further comprising:

selectively printing and etching the second metal layer;

photo-exposing the dielectric layer and baking the embedded assembly;

removing the photo-exposed dielectric layer, wherein the photo-exposed dielectric layer is removed by treating the photo-exposed dielectric layer with a solvent to expose the first metal layer;

laminating a resin layer on exposed surfaces of the first metal layer and the second metal layer to provide a third metal layer, wherein the third metal layer is one of the plurality of metal layers; and

providing and plating one or more microvias and plated through holes.

16. The method as recited in claim 15 further comprising:

pattern-plating one or more metal contact pads on the third metal layer;

selectively printing and etching the third metal layer and one or more antenna metallization patterns;

surface finishing exposed surfaces of the one or more metal contact pads; and

applying a sacrificial layer on the third metal layer.

17. The method as recited in claim 16 further comprising:

performing latent imaging on the sacrificial layer;

laminating a pre-processed resin-coated foil;

selectively printing and etching the pre-processed resin-coated foil; and

baking the embedded assembly and remove the sacrificial layer.

18. The method as recited in claim 17, wherein the at least one movable element is embedded and connected to the at least one antenna element corresponding to the one or more antenna metallization patterns, further wherein the one or more antenna metallization patterns are formed on at least one of the plurality of metal layers.

19. The method as recited in claim 18, wherein the at least one movable element is secured as a separate package to an exposed metal layer of the plurality of metal layers.

20. The method as recited in claim 13 further comprising embedding at least one passive device on the organic substrate, wherein the at least one passive device is at least one of:

a switch, a variable/tuner capacitor, a polymer thick film resistor, an inductor, and a MEMS resonator.