REDUCTION OF FALSE ALARMS IN PCB INSPECTION
First Claim
Patent Images
1. A method of determining defects in electrical circuits, comprising:
- acquiring an optical image of an electrical circuit;
generating a representation of the electrical circuit from the image;
analyzing at least part of the representation at a region near a candidate to detect an attribute of the electrical circuit;
revising the representation in response to a detected attribute of the electrical circuit;
processing the revised image to determine the presence of a real defect the electrical circuit.
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Abstract
A method for automatically optically inspecting an electrical circuit, comprising: acquiring at least one optical image of an electrical circuit; generating at least one first inspection image from the at least one image and determining regions of candidate defects therefrom; generating at least one additional inspection image for regions surrounding candidate defects, said at least one additional inspection image at least partially including optical information not included in the at least one first inspection image; and determining whether the candidate defect is a specious defect by inspecting the at least one additional inspection image.
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Citations
41 Claims
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1. A method of determining defects in electrical circuits, comprising:
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acquiring an optical image of an electrical circuit;
generating a representation of the electrical circuit from the image;
analyzing at least part of the representation at a region near a candidate to detect an attribute of the electrical circuit;
revising the representation in response to a detected attribute of the electrical circuit;
processing the revised image to determine the presence of a real defect the electrical circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method for inspecting printed circuit boards for defects, comprising:
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acquiring an image of a printed circuit board;
performing automated optical inspection on the image to identify candidate defects on the printed circuit board;
providing an image of a region surrounding a candidate defect to a processor, said image including a map of putative contours corresponding to the candidate defect;
analyzing the image of the region surrounding the candidate defect;
revising the putative contour map to provide a revised contour map in response to a predetermined condition occurring in the image, the revised contour map including revised contours corresponding to the candidate defect; and
inspecting the revised contour map to determine the presence of an actual defect in the electrical circuit. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification