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LIGHT EMITTING DIODES (LEDs) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING

  • US 20070166851A1
  • Filed: 12/29/2006
  • Published: 07/19/2007
  • Est. Priority Date: 01/11/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a light-emitting diode (LED) wafer assembly, comprising;

    a conductive substrate;

    a p-doped layer disposed above the conductive substrate;

    an active layer disposed above the p-doped layer;

    an n-doped layer disposed above the active layer;

    applying a mask to a surface of the n-doped layer;

    etching the surface of the n-doped layer such that etched pits are formed in the surface;

    removing the mask; and

    roughening or texturing the surface of the n-doped layer including the etched pits.

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