Integrated circuit package system with image sensor system
First Claim
Patent Images
1. An integrated circuit package system comprising:
- providing a wafer including image sensor systems having interconnects connected thereto;
encapsulating the image sensor systems and the interconnects in a transparent encapsulant;
removing a portion of the transparent encapsulant to expose portions of the interconnects; and
singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.
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Abstract
An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.
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Citations
20 Claims
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1. An integrated circuit package system comprising:
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providing a wafer including image sensor systems having interconnects connected thereto;
encapsulating the image sensor systems and the interconnects in a transparent encapsulant;
removing a portion of the transparent encapsulant to expose portions of the interconnects; and
singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An integrated circuit package system comprising:
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an integrated circuit die including an image sensor system having interconnects connected thereto; and
a transparent encapsulant on the integrated circuit die and encapsulating the image sensor system and the interconnects, the transparent encapsulant having a portion of the transparent encapsulant removed to expose portions of the interconnects and to comprise an image sensor device. - View Dependent Claims (12, 13, 14, 15)
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16. An integrated circuit package system comprising:
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an integrated circuit die including image sensor systems having interconnects connected thereto; and
a transparent encapsulant encapsulating the image sensor systems and the interconnects in a transparent encapsulant, the transparent encapsulant having a notch to expose portions of the interconnects and to comprise an image sensor device. - View Dependent Claims (17, 18, 19, 20)
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Specification