Integrated circuit package system with image sensor system

• US 20070166867A1
• Filed: 01/04/2006
• Published: 07/19/2007
• Est. Priority Date: 01/04/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Kuan, Heap Hoe, Chow, Seng
• Granted Patent: US 7,723,146 B2
• Time in Patent Office: Days
• US Class Current: 438/65
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

Claims

1. An integrated circuit package system comprising:

providing a wafer including image sensor systems having interconnects connected thereto;

encapsulating the image sensor systems and the interconnects in a transparent encapsulant;

removing a portion of the transparent encapsulant to expose portions of the interconnects; and

singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

2. The system as claimed in claim 1 further comprising:

providing a substrate; and

mounting at least one of the image sensor devices on the substrate with the number of the interconnects connected to the substrate.

3. The system as claimed in claim 1 further comprising:

providing a substrate having an aperture provided therein; and

mounting at least one of the image sensor devices at least partially in the aperture with the number of interconnects connected to the substrate.

4. The system as claimed in claim 1 further comprising:

providing a substrate having an aperture provided therein and substrate connectors on the bottom thereof; and

mounting at least one of the image sensor devices at least partially in the aperture and among the substrate connectors with the number of interconnects connected to the substrate.

5. The system as claimed in claim 1 further comprising:

providing a substrate having a dam around the periphery thereof;

mounting at least one of the image sensor devices on the substrate with the number of the interconnects connected to the substrate; and

filling the dam with a liquid encapsulant material around the at least one of the image sensor devices.

6. The system as claimed in claim 1 wherein:

removing the portion of the transparent encapsulant includes notching the transparent encapsulant to expose the portion of the interconnects; and

grinding the bottom of the wafer.

7. The system as claimed in claim 6 further comprising:

providing a substrate;

mounting at least one of the image sensor devices face up on the substrate with the number of the interconnects connected to the substrate by bonding wires; and

encapsulating the bonding wires.

8. The system as claimed in claim 6 further comprising:

providing a substrate having an aperture provided therein;

mounting at least one of the image sensor devices face up or face down at least partially in the aperture with the number of interconnects connected to the substrate by bonding wires or electrical connections; and

encapsulating the bonding wires.

9. The system as claimed in claim 6 further comprising:

providing a substrate having an aperture provided therein and board substrate connectors on the bottom thereof;

mounting at least one of the image sensor devices face up at least partially in the aperture and among the substrate connectors with the number of interconnects connected to the substrate by bonding wires or electrical connections; and

encapsulating the bonding wires.

10. The system as claimed in claim 6 further comprising:

providing a substrate having a dam around the periphery thereof;

mounting at least one of the image sensor devices on the substrate with the number of the interconnects connected to the substrate by bonding wires;

filling the dam with a liquid encapsulant material to cover the bonding wires; and

solidifying the liquid encapsulant material.

11. An integrated circuit package system comprising:

an integrated circuit die including an image sensor system having interconnects connected thereto; and

a transparent encapsulant on the integrated circuit die and encapsulating the image sensor system and the interconnects, the transparent encapsulant having a portion of the transparent encapsulant removed to expose portions of the interconnects and to comprise an image sensor device.

12. The system as claimed in claim 11 further comprising:

a substrate; and

the image sensor device mounted on the substrate with the interconnects connected to the substrate.

13. The system as claimed in claim 11 further comprising:

a substrate having an aperture provided therein; and

the image sensor device mounted on the substrate at least partially in the aperture with the interconnects connected to the substrate.

14. The system as claimed in claim 11 further comprising:

a substrate having an aperture provided therein and board substrate connectors on the bottom thereof; and

the image sensor device mounted on the substrate at least partially in the aperture and among the substrate connectors with the interconnects connected to the substrate.

15. The system as claimed in claim 11 further comprising:

a substrate having a dam around the periphery thereof;

the image sensor device mounted on the substrate with the interconnects connected to the substrate; and

a liquid encapsulant material around the image sensor device and filling the dam.

16. An integrated circuit package system comprising:

an integrated circuit die including image sensor systems having interconnects connected thereto; and

a transparent encapsulant encapsulating the image sensor systems and the interconnects in a transparent encapsulant, the transparent encapsulant having a notch to expose portions of the interconnects and to comprise an image sensor device.

17. The system as claimed in claim 16 further comprising:

a substrate having passive or active devices electrically connected thereto;

the image sensor device mounted face up on the substrate with the interconnects connected to the substrate by bonding wires; and

an encapsulant encapsulating the bonding wires.

18. The system as claimed in claim 16 further comprising:

a substrate having passive or active devices electrically connected thereto and having an aperture provided therein;

the image sensor device mounted face up or face down at least partially in the aperture with the interconnects connected to the substrate by bonding wires or electrical connections; and

an encapsulant encapsulating the bonding wires.

19. The system as claimed in claim 16 further comprising:

a substrate having passive or active devices electrically connected thereto and having an aperture provided therein and substrate connectors on the bottom thereof;

the image sensor device mounted face up at least partially in the aperture and among the substrate connectors with the interconnects connected to the substrate by bonding wires or electrical connections; and

an encapsulant encapsulating the bonding wires.

20. The system as claimed in claim 16 further comprising:

a substrate having a dam around the periphery thereof;

the image sensor device mounted on the substrate with the interconnects connected to the substrate by bonding wires; and

a solidified liquid encapsulant material in the dam to cover the bonding wires.