Process for producing a photoelectric conversion device
First Claim
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1. A process for producing a semiconductor device, comprising:
- forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a second semiconductor film containing a rare gas element over the first semiconductor film having the crystal structure;
conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film; and
removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing.
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Abstract
A catalyst element remaining in a first semiconductor film subjected to a first heat treatment (crystallization) is moved and concentrated/collected by subjecting a second semiconductor film which is formed on the first semiconductor film and contains a rare gas element to a second heat treatment. That is, the rare gas element is incorporated into the second semiconductor film to generate a strain field as a gettering site.
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Citations
44 Claims
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1. A process for producing a semiconductor device, comprising:
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forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a second semiconductor film containing a rare gas element over the first semiconductor film having the crystal structure;
conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film; and
removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A process for producing a semiconductor device, comprising:
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forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a barrier layer over a surface of the first semiconductor film having the crystal structure;
forming a second semiconductor film containing a rare gas element over the barrier layer, conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film, and removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A process for producing a semiconductor device, comprising:
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forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a second semiconductor film over the first semiconductor film having the crystal structure;
adding a rare gas element to the second semiconductor film;
conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film, and removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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30. A process for producing a semiconductor device, comprising:
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forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a barrier layer over a surface of the first semiconductor film having the crystal structure;
forming a second semiconductor film over the barrier layer;
adding a rare gas element to the second semiconductor film;
conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film; and
removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A process for producing a semiconductor device, comprising:
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forming a first semiconductor film having an amorphous structure;
adding an element for promoting crystallization to the first semiconductor film having the amorphous structure;
conducting a first heat treatment to form a first semiconductor film having a crystal structure;
forming a second semiconductor film over the first semiconductor film having the crystal structure, wherein a rare gas element is added to the second semiconductor film;
conducting a second heat treatment to segregate the element for promoting crystallization into the second semiconductor film; and
removing the second semiconductor film, wherein the second heat treatment is conducted by rapid thermal annealing. - View Dependent Claims (42, 43, 44)
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Specification