Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

• US 20070170228A1
• Filed: 01/20/2006
• Published: 07/26/2007
• Est. Priority Date: 01/20/2006
• Status: Active Grant

• Current Assignee: Memsic Semiconductor (Wuxi) Co., Ltd. (MZ Investment Holdings Ltd.)
• Original Assignee: Memsic Incorporated (MZ Investment Holdings Ltd.)
• Inventors: Zhao, Yang, Li, Zongya, Huang, Feiming
• Granted Patent: US 7,536,909 B2
• Time in Patent Office: Days
• US Class Current: 228/102
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]

Abstract

Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.

Claims

1. A device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the device comprising:

a leadframe having a paddle portion;

at least one X- and Y-axis sensor die that is structured and arranged to be in one or more of physical communication and operational communication with the paddle portion of the leadframe and one or more of a plurality of input/output pads;

an integrated circuit that is structured and arranged to be in one or more of physical communication and operational communication with the paddle portion of the leadframe and one or more of the plurality of input/output pads; and

a Z-axis sensor die that is structured and arranged to be in one or more of physical communication and operational communication with the leadframe, the at least one X- and Y-axis sensor die, the integrated circuit, and one or more of the plurality of input/output pads,

wherein the leadframe, the at least one X- and Y-axis sensor die, the plurality of input/output pads, the integrated circuit, and the Z-axis sensor die are encapsulated to provide a final molding.

2. The device as recited in claim 1, wherein the leadframe includes a plurality of leadframe legs and each of the sensor dies has a sensing direction, and the Z-axis sensor die is structured and arranged to be in communication with one or more of the plurality of leadframe legs so that the sensing direction of said Z-axis sensor die is orthogonal or substantially orthogonal to sensing directions of the at least one X- and Y-axis sensor die.

3. The device as recited in claim 2, wherein the sensing direction of the Z-axis sensor die is initially structured and arranged to be in the same plane or substantially in the same plane as the one or more of the plurality of leadframe legs and wherein selected ones of the leadframe legs are rotatable so that the plane of said one or more of a plurality of leadframe legs is orthogonal or substantially orthogonal to the sensing directions of the at least one X- and Y-axis sensor die.

4. The device as recited in claim 1, wherein the leadframe includes a preformed vertical or substantially vertical paddle to which the Z-axis sensor die is in one or more of physical communication and operational communication.

5. The device as recited as claim 4, wherein the device further comprises a plurality of preformed leads to which the Z-axis sensor die is in operational communication.

6. The device as recited in claim 1, wherein the Z-axis sensor die, some portion of the leadframe, and some portion of the plurality of input/output pads are encapsulated to provide a pre-molding that is further encapsulated in the final molding.

7. The device as recited in claim 1, wherein the at least one X- and Y-axis sensor die, some portion of the leadframe, the integrated circuit, and some portion of the I/O pads are encapsulated to provide a pre-molding that is further encapsulated in the final molding.

8. The device as recited in claim 1, wherein the integrated circuit is an application-specific integrated circuit.

9. The device as recited in claim 1, wherein the device is a tri-axial sensor.

10. A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the method comprising:

providing a leadframe, a plurality of input/output leads, and a plurality of z-axis sensor leads;

attaching at least one X- and Y-axis sensor die and at least one integrated circuit to be in physical and/or operational communication with the leadframe, the plurality of input/output leads, and the plurality of z-axis sensor leads;

attaching a z-axis sensor die, having a sensing direction, to the leadframe and the plurality of z-axis sensor leads so that the sensing direction is substantially orthogonal to sensing directions of the at least one X- and Y-axis sensor die; and

encapsulating the leadframe, the plurality of input/output leads, the plurality of Z-axis sensor leads, the at least one X- and Y-axis sensor die, the at least one integrated circuit, and the Z-axis sensor die in a final molding.

11. The method as recited in claim 10, wherein the step of providing a leadframe comprises providing a leadframe that is structured and arranged with a vertical or substantially vertical portion.

12. The method as recited in claim 11, wherein the Z-axis sensor die is attached to the substantially vertical portion of the leadframe.

13. The method as recited in claim 12, wherein the Z-axis sensor die is attached to the substantially vertical portion by soldering, wire-bonding, flip-chip bonding or adhesively.

14. The method as recited in claim 10, wherein the step of providing a leadframe comprises providing a leadframe having a paddle portion and a plurality of leadframe legs.

15. The method as recited in claim 14, wherein the Z-axis sensor die is attached to the plurality of leadframe legs and the plurality of Z-axis sensor leads.

16. The method as recited in claim 15, wherein the Z-axis sensor die is attached to the substantially vertical portion by soldering, wire-bonding, flip-chip bonding or adhesively.

17. The method as recited in claim 10, wherein the step of attaching at least one X- and Y-axis sensor die and at least one integrated circuit includes attaching said at least one X- and Y-axis sensor die and said at least one integrated circuit to the leadframe, the plurality of input/output leads, and the plurality of Z-axis sensor leads by one or more of soldering, wire-bonding, flip-chip bonding and adhesively.

18. The method as recited in claim 10, wherein the method further comprises pre-encapsulating the Z-axis sensor die, some portion of the plurality of input/output leads, and some portion of the plurality of Z-axis sensor leads or pre-encapsulating the leadframe, some portion of said plurality of input/output leads, some portion of said plurality of Z-axis sensor leads, the at least one X- and Y-axis sensor die, and the at least one integrated circuit in a pre-molding prior to the encapsulating step.

19. The method as recited in claim 10, wherein the step of attaching the Z-axis sensor die includes:

initially attaching the Z-axis sensor die to at least two of the plurality of input/output leads and to at least two of the plurality of Z-axis sensor leads so that the sensing direction is in the same or substantially the same plane as the sensing directions of the at least one X- and Y-axis sensor die;

pre-encapsulating the Z-axis sensor die, some portion of the plurality of input/output leads, and some portion of the plurality of Z-axis sensor lead; and

re-positioning the pre-encapsulated Z-axis sensor die so that the sensing direction is orthogonal or substantially orthogonal to the sensing directions of the at least one X- and Y-axis sensor die.

20. The method as recited in claim 19, wherein the pre-encapsulated Z-axis sensor die is re-positioned by bending said pre-encapsulated Z-axis sensor die, plurality of input/output leads, and plurality of Z-axis sensor leads approximately 90 degrees from horizontal.

21. A device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the device comprising:

a base substrate having an inner cavity defined by a plurality of inner side walls, and a bottom portion;

at least one X- and Y-axis sensor die that is structured and arranged within the inner cavity between the plurality of inner side walls and in operational communication with at least one of a plurality of input/output pads; and

a Z-axis sensor die that is structured and arranged to be in at least one of physical communication and operational communication with the substrate, the at least one X- and Y-axis sensor die, and the at least one of the plurality of input/output pads.

22. The device as recited in claim 21, wherein each side wall of a pair of opposing side walls of the inner cavity includes a slotted portion for mounting the z-axis sensor die vertically.

23. The device as recited in claim 22, wherein the slotted portion includes one or more of a plurality of input/output pads and a plurality of interconnection pads that are structured and arranged in the bottom portion of the inner cavity.

24. The device as recited in claim 21, wherein the device further comprises an integrated circuit that is structured and arranged within the inner cavity between the plurality of inner side walls and in operational communication with at least one of the plurality of input/output pads that is disposed about said plurality of inner side walls.

25. The device as recited in claim 21, wherein the base substrate includes an outer periphery on which a plurality of input/output connections is structured and arranged.

26. The device as recited in claim 25, wherein the device further comprises a sub-cavity for the Z-axis sensor.

27. The device as recited in claim 21, wherein the Z-axis sensor is first structured and arranged on a substrate carrier having a plurality of input/output pads and interconnections.

28. The device as recited in claim 21, wherein the at least one integrated circuit is an application-specific integrated circuit.

29. The device as recited in claim 21, wherein the device is a tri-axial sensor.

30. A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the method comprising:

providing a base substrate having a cavity portion and a plurality of input/output interconnections structured and arranged on at least three side walls of the cavity portion;

attaching at least one X- and Y-axis sensor die to the base substrate and operationally connecting the at least one X- and Y-axis sensor die to some of the plurality of input/output interconnections; and

attaching a Z-axis sensor die, having a sensing direction, to the base substrate and some of the plurality of input/output interconnections so that the sensing direction is substantially orthogonal to sensing directions of the at least one X- and Y-axis sensor die.

31. The method as recited in claim 30, wherein the step of attaching the at least one X- and Y-axis sensor die to some of the plurality of input/output interconnections includes by at least one of soldering, wire-bonding, flip-chip bonding, and adhesively.

32. The method as recited in claim 30, wherein the method further comprises providing at least one integrated circuit.

33. The method as recited in claim 30, wherein the step of attaching the Z-axis sensor die includes:

providing a slotted portion in opposing side walls of the cavity; and

installing the Z-axis sensor die into the slotted portion so that the sensing direction of said Z-axis sensor die is orthogonal or substantially orthogonal to the sensing directions of the at least one X- and Y-axis sensor die.

34. The method as recited in claim 33, wherein the step of installing the Z-axis sensor die into the slotted portion includes installing said Z-axis sensor die into said slotted portion so that the input/output pads and bonding pads that are structured and arranged on said Z-axis sensor die are in registration with corresponding interconnection pads that are structured and arranged in the slotted portion of the base substrate.

35. The method as recited in claim 34, wherein input/output pads, bonding pads, and interconnection pads are attached to one another using a reflow soldering process.

36. The method as recited in claim 30, wherein the method further comprises providing a sub-cavity for the Z-axis sensor die.

37. The method as recited in claim 30, wherein the step of attaching the Z-axis sensor die includes first attaching a Z-axis sensor to a substrate having a plurality of input/output interconnections and bonding pads structured and arranged thereon that are in registration with corresponding interconnections structured and arranged in the slotted portion of the base substrate.

38. A device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the device comprising:

a flexible carrier;

at least one X- and Y-axis sensor die that is in at least one of physical communication and operational communication with the flexible carrier;

at least one integrated circuit that is in at least one of physical communication and operational communication with the flexible carrier;

a Z-axis sensor die that is in at least one of physical communication and operational communication with a distal end portion of the flexible carrier, wherein the distal end portion is rotated so that said distal end portion is oriented substantially orthogonal to a proximal end of said flexible carrier; and

a rigid substrate, having a longer, planar portion and a shorter, orthogonal portion that is orthogonal or substantially orthogonal to the longer, planar portion, that is in physical and/or operational communication with the flexible carrier.

39. The device as recited in claim 38, wherein the device further comprises a molding that encapsulates the flexible carrier, the at least one X- and Y-axis sensor die, the at least one integrated circuit, the Z-axis sensor, and the rigid substrate.

40. A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the method comprising:

structuring and arranging a Z-axis sensor die, at least one X- and Y-axis sensor die, and at least one integrated circuit to a flexible carrier;

reconfiguring that portion of the flexible carrier on which the Z-axis sensor die is structured and arranged so that said portion of the flexible carrier is substantially vertical with respect to the flexible carrier and a sensing direction of the Z-axis sensor die is substantially orthogonal to sensing directions of the at least one X- and Y-axis sensor die;

structuring and arranging the flexible carrier to a rigid substrate having a base portion and a preformed vertical or substantially vertical portion; and

encapsulating the substrate, the flexible carrier, the at least one X- and Y-axis sensor die, the at least one integrated circuit, and the Z-axis sensor die in a molding.

41. The method as recited in claim 40, wherein the Z-axis sensor die, the at least one X- and Y-axis sensor die, and the at least one integrated circuit are attached to the flexible carrier by flip-chip bonding or wire-bonding.

42. The method as recited in claim 40, wherein the flexible carrier is attached to the substrate carrier by bump-bonding or wire-bonding.

43. A device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the device comprising:

a base substrate;

at least one X- and Y-axis sensor that is in physical and/or operational communication with the base substrate;

at least one integrated circuit that is in physical and/or operational communication with the base substrate;

a cube carrier that is in at least one of physical communication and operational communication with the base substrate; and

at least one Z-axis sensor die that is in at least one of physical communication and operational communication with the cube carrier so that each of the one or more Z-axis sensor dies is oriented substantially orthogonal to said base substrate.

44. The device as recited in claim 43, the device further comprising a molding that encapsulates the base substrate, the at least one X- and Y-axis sensor die, the at least one integrated circuit, and the at least one Z-axis sensor die.

45. The device as recited in claims 43, wherein the at least one integrated circuit is an application-specific integrated circuit.

46. A method of manufacturing a device for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction, the method comprising:

attaching a cube carrier, having a plurality of input/output pads on a plurality of faces, to a substrate;

attaching at least one X- and Y-axis sensor die to the substrate;

attaching at least one integrated circuit to the substrate;

attaching at least one Z-axis sensor die to at least one of the plurality of faces of said cube carrier; and

encapsulating the substrate, the cube carrier, the at least one X- and Y-axis die, the at least one integrated circuits, and the at least one Z-axis sensor die in a molding.

47. The method as recited in claim 46, wherein the at least one Z-axis sensor die is attached to at least one substantially vertical faces of the cube carrier by soldering, wire-bonding, flip-chip bonding or adhesively.

48. The method as recited in claim 46, wherein the at least one X- and Y-axis sensor die and the at least one integrated circuit are attached to the substrate or to each other by one or more of soldering, wire-bonding, flip-chip bonding, and adhesively.

49. The method as recited in claim 46, wherein the cube carrier is attached to the substrate by SMT reflow soldering.

50. The method as recited in claim 46, wherein two Z-axis sensor dies are attached to two substantially vertical faces of the cube carrier that are orthogonal to each other.