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Systems and methods for bonding

  • US 20070170360A1
  • Filed: 11/30/2006
  • Published: 07/26/2007
  • Est. Priority Date: 01/26/2006
  • Status: Active Grant
First Claim
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1. A method of bonding a first wafer to a second wafer, comprising:

  • segmenting at least a portion of said first wafer into multiple portions;

    assembling said multiple portions of said first wafer to at least a portion of a second wafer that is unsegmented; and

    bonding said multiple portions of said first wafer to at least a portion of said second wafer that is unsegmented.

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