Systems and methods for bonding
First Claim
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1. A method of bonding a first wafer to a second wafer, comprising:
- segmenting at least a portion of said first wafer into multiple portions;
assembling said multiple portions of said first wafer to at least a portion of a second wafer that is unsegmented; and
bonding said multiple portions of said first wafer to at least a portion of said second wafer that is unsegmented.
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Abstract
Systems and methods for bonding semiconductor devices and/or multiple wafers, in the form of a first segmented wafer and a second unsegmented wafer which may have different temperature coefficients of expansion (TCE), and which may be bonded together, with or without the presence of a vacuum.
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Citations
32 Claims
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1. A method of bonding a first wafer to a second wafer, comprising:
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segmenting at least a portion of said first wafer into multiple portions; assembling said multiple portions of said first wafer to at least a portion of a second wafer that is unsegmented; and bonding said multiple portions of said first wafer to at least a portion of said second wafer that is unsegmented. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of bonding a lid wafer to a device wafer, comprising:
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providing a device wafer that comprises a plurality of focal plane array (FPA) devices; segmenting at least a portion of said lid wafer into a plurality of individual window lid components, each of said individual window lid components corresponding to an individual one of said FPA devices of said device wafer; assembling said individual window lid components of said lid wafer to at least a portion of said device wafer that is unsegmented so that each of said individual window lid components is assembled over a corresponding one of said FPA devices of said unsegmented device wafer; and bonding said individual window lid components of said lid wafer to at least a portion of said device wafer that is unsegmented so that each of said individual window lid components is bonded over a corresponding one of said FPA devices of said device wafer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A wafer level assembly, comprising:
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multiple segmented portions of a first wafer; a second unsegmented wafer; wherein said multiple segmented portions of said first wafer are bonded to at least a portion of said second unsegmented wafer. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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29. A method of bonding, comprising:
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providing a plurality of first separate components, each of said first separate components comprising one or more semiconductor devices; providing one or more second separate components; disposing said plurality of said first separate components together in adjacent relationship and in a common plane; disposing said one or more second separate components in a common plane; assembling said plurality of said first separate components to said one or more second separate components by bringing together said plurality of said first separate components disposed together in adjacent relationship in a common plane with said one or more said second separate components disposed in a common plane; and bonding said plurality of said first separate components to said at least one second separate components while said plurality of said first separate components are so assembled to said one or more said second separate components. - View Dependent Claims (30, 31, 32)
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Specification