Wafer encapsulated microelectromechanical structure and method of manufacturing same
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
107 Citations
67 Claims
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1-30. -30. (canceled)
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31. A method comprising:
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forming a microelectromechanical structure in a portion of a first substrate; securing a second substrate to the first substrate; and providing circuitry in or on the second substrate after securing the second substrate to the first substrate. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A method comprising:
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providing a first substrate; securing a second substrate to the first substrate; forming a microelectromechanical structure in a portion of the second substrate; securing a third substrate to the second substrate; and providing circuitry in or on the third substrate after securing the third substrate to the second substrate. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67)
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Specification