Wafer encapsulated microelectromechanical structure and method of manufacturing same
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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Citations
61 Claims
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1-30. -30. (canceled)
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31. A microelectromechanical device comprising:
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a first substrate; a chamber; a microelectromechanical structure, wherein the microelectromechanical structure is (i) formed from a portion of the first substrate and (ii) at least partially disposed in the chamber; a second substrate, bonded to the first substrate, wherein a surface of the second substrate forms a wall of the chamber; a trench, disposed in the second substrate; and an isolation region, disposed in or on the first substrate and aligned with the trench. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A microelectromechanical device comprising:
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a first substrate; a second substrate, wherein the second substrate is bonded to the first substrate; a chamber; a microelectromechanical structure, wherein the microelectromechanical structure is (i) formed from a portion of the second substrate and (ii) at least partially disposed in the chamber; a third substrate, bonded to the second substrate, wherein a surface of the third substrate forms a wall of the chamber; a trench, disposed in the third substrate; and an isolation region, disposed in or on the second substrate and aligned with the trench. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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Specification