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Semiconductor device having flange structure

  • US 20070170556A1
  • Filed: 12/07/2006
  • Published: 07/26/2007
  • Est. Priority Date: 01/20/2006
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising:

  • a semiconductor element;

    a layer of material provided on the semiconductor element having an opening through which a first bond pad is exposed; and

    at least one flange structure provided on the first bond pad, the at least one flange structure made of at least two metal layers with different etch rates.

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