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Multilayer integrated circuit for RF communication and method for assembly thereof

  • US 20070170583A1
  • Filed: 09/27/2006
  • Published: 07/26/2007
  • Est. Priority Date: 03/24/2004
  • Status: Active Grant
First Claim
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1. A vertically integrated radio frequency module, comprising:

  • a radio frequency integrated circuit die including, on an upper surface thereof, an active integrated circuit pattern having an input/output pad;

    a conductor disposed on the input/output pad; and

    an integrated passive device die disposed above the radio frequency integrated circuit die and including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor.

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