Multilayer integrated circuit for RF communication and method for assembly thereof
First Claim
1. A vertically integrated radio frequency module, comprising:
- a radio frequency integrated circuit die including, on an upper surface thereof, an active integrated circuit pattern having an input/output pad;
a conductor disposed on the input/output pad; and
an integrated passive device die disposed above the radio frequency integrated circuit die and including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor.
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Accused Products
Abstract
A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package comprises a radio frequency integrated circuit (RFIC) attached to a recessed area of a lead frame. The RFIC has an active integrated circuit pattern and a plurality of conductors formed on input/output pads of the active integrated circuit pattern. An integrated passive device (IPD) is attached to the RFIC via the plurality of conductors. The IPD has a passive integrated circuit pattern, a plurality of electrode pads connected to nodes of the passive integrated circuit pattern, and metal-filled vias for electrically connecting the electrode pads to the plurality of conductors. The RFIC includes a plurality of heat conducting vias for conducting heat to the lead frame.
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Citations
43 Claims
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1. A vertically integrated radio frequency module, comprising:
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a radio frequency integrated circuit die including, on an upper surface thereof, an active integrated circuit pattern having an input/output pad;
a conductor disposed on the input/output pad; and
an integrated passive device die disposed above the radio frequency integrated circuit die and including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A vertically integrated radio frequency module package, comprising:
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a lead frame;
a radio frequency integrated circuit die attached to the lead frame and including, on an upper surface thereof, an active integrated circuit pattern having an input/output pad;
a conductor disposed on the input/output pad; and
an integrated passive device die disposed above the radio frequency integrated circuit die and including, on an upper surface thereof, a passive integrated circuit pattern having an electrode pad electrically connected to the conductor. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of assembling a vertically integrated radio frequency module package, the method comprising:
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preparing a first wafer including defining an active integrated circuit pattern;
preparing a second wafer including defining a passive integrated circuit pattern;
simultaneously sawing the first and second wafers to form from the first wafer a radio frequency integrated circuit die having the active integrated circuit pattern on an upper surface thereof, and from the second wafer an integrated passive device die having the passive integrated circuit pattern on an upper surface thereof;
attaching the radio frequency integrated circuit die to a lead frame; and
joining a bottom surface of the integrated passive device die to an upper surface of the radio frequency integrated circuit die. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification